參數(shù)資料
型號: WED3DG6435V75JD1-QG
廠商: MICROSEMI CORP-PMG MICROELECTRONICS
元件分類: DRAM
英文描述: 32M X 64 SYNCHRONOUS DRAM MODULE, 5.4 ns, DMA144
封裝: ROHS COMPLIANT, SODIMM-144
文件頁數(shù): 6/8頁
文件大?。?/td> 157K
代理商: WED3DG6435V75JD1-QG
WED3DG6435V-D1
-JD1
6
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
May 2007
Rev. 7
ORDERING INFORMATION FOR D1
Ordering Information
Speed
CAS Latency
Height*
WED3DG6435V10D1-xG
100MHz
CL=2
31.75 (1.250”)
WED3DG6435V7D1-xG
133MHz
CL=2
31.75 (1.250”)
WED3DG6435V75D1-xG
133MHz
CL=3
31.75 (1.250”)
NOTES:
RoHS compliant products. (G = RoHS Compliant) “G” is added at the end of the part number.
Vendor specic part numbers are used to provide memory components source control. The place holder for this is shown as lower case “-x” in the part numbers above and is
to be replaced with the respective vendors code. Consult factory for qualied sourcing options. (M = Micron, S = Samsung, G = Qimonda & consult factory for others)
Consult factory for availability of industrial temperature (-40°C to 85°C) option
ORDERING INFORMATION FOR JD1
Ordering Information
Speed
CAS Latency
Height*
WED3DG6435V10JD1-xG
100MHz
CL=2
31.75 (1.250”)
WED3DG6435V7JD1-xG
133MHz
CL=2
31.75 (1.250”)
WED3DG6435V75JD1-xG
133MHz
CL=3
31.75 (1.250”)
NOTES:
RoHS compliant products. (G = RoHS Compliant) “G” is added at the end of the part number.
Vendor specic part numbers are used to provide memory components source control. The place holder for this is shown as lower case “-x” in the part numbers above and is
to be replaced with the respective vendors code. Consult factory for qualied sourcing options. (M = Micron, S = Samsung, G = Qimonda & consult factory for others)
Consult factory for availability of industrial temperature (-40°C to 85°C) option
3.99
(0.157)
2.01 (0.079 Min)
67.72
(2.661 Max)
32.79
(1.291)
4.60 (0.181)
1.50 (0.059)
28.2
(1.112)
23.14
(0.913)
19.99
(0.787)
31.75
(1.250)
Max
3.81
(0.150)
MAX.
0.99
(0.039)
(± 0.004)
PACKAGE DIMENSIONS FOR D1 AND JD1
* ALL DIMENSIONS ARE IN MILLIMETERS AND (INCHES).
相關PDF資料
PDF描述
WS128K32N-15H1QA 128K X 32 MULTI DEVICE SRAM MODULE, 15 ns, CPGA66
WS128K32N-17H1IA 128K X 32 MULTI DEVICE SRAM MODULE, 17 ns, CPGA66
WS128K32N-25H1M 128K X 32 MULTI DEVICE SRAM MODULE, 25 ns, CPGA66
WSE128K16-42G2TMA SPECIALTY MEMORY CIRCUIT, CQMA68
WED2ZL362MS30BC 2M X 36 MULTI DEVICE SRAM MODULE, 3 ns, PBGA119
相關代理商/技術參數(shù)
參數(shù)描述
WED3DG6435V7AD1 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:256MB - 32Mx64 SDRAM UNBUFFERED
WED3DG6435V7D1 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:256MB - 32Mx64 SDRAM UNBUFFERED
WED3DG6435V7JD1 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:256MB - 32Mx64 SDRAM UNBUFFERED
WED3DG6435V-AD1 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:256MB - 32Mx64 SDRAM UNBUFFERED
WED3DG6435V-D1 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:256MB - 32Mx64 SDRAM UNBUFFERED