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參數(shù)資料
| 型號： | WED2ZL362MS30BC |
| 廠商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分類： | SRAM |
| 英文描述： | 2M X 36 MULTI DEVICE SRAM MODULE, 3 ns, PBGA119 |
| 封裝： | PLASTIC, BGA-119 |
| 文件頁數(shù)： | 4/12頁 |
| 文件大?。?/td> | 272K |
| 代理商： | WED2ZL362MS30BC |
12
White Electronic Designs Corporation Westborough, MA (508) 366-5151
White Electronic Designs
WED2ZL362MS
PACKAGE DIMENSION: 119 BUMP PBGA
ALL LINEAR DIMENSIONS ARE IN MILLIMETERS AND PARENTHETICALLY IN INCHES
2.50 (0.110)
MAX
0.600 (0.024)
MAX
1.27 (0.050)
TYP
1.27 (0.050) TYP
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
14.00 (0.551) TYP
A1
CORNER
20.32 (0.800)
TYP
22.00 (0.866)
TYP
7.62 (0.300)
TYP
R 1.52 (0.060)
MAX (4x)
7 6
5
4
3
2
1
ORDERING INFORMATION
Commercial Temp Range (0°C to 70°C), Industrial Temp. Range (-40° to 85°C)
Part Number
Configuration
tCD
Clock
Operating
(ns)
(MHz)
Range
WED2ZL362MS35ES
2M x 36
3.5
166
Engineering Samples
WED2ZL362MS38ES
2M x 36
3.8
150
Engineering Samples
WED2ZL362MS28BC
2M x 36
2.8
225
Commercial
WED2ZL362MS30BC
2M x 36
3.0
200
Commercial
WED2ZL362MS35BC
2M x 36
3.5
166
Commercial
WED2ZL362MS38BC
2M x 36
3.8
150
Commercial
WED2ZL362MS30BI
2M x 36
3.0
200
Industrial
WED2ZL362MS35BI
2M x 36
3.5
166
Industrial
WED2ZL362MS38BI
2M x 36
3.8
150
Industrial
NOTE: Ball attach pad for above BGA package is 620 microns in diameter. Pad is solder mask defined.
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| WED2ZL362MSJ | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:NBL SSRAM MCP |
| WED2ZL64512S | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512K x 64 Synchronous Pipeline NBL SRAM |
| WED2ZL64512S35BC | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512K x 64 Synchronous Pipeline NBL SRAM |
| WED2ZL64512S38BC | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512K x 64 Synchronous Pipeline NBL SRAM |
| WED2ZL64512S42BC | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512K x 64 Synchronous Pipeline NBL SRAM |
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