| 型號(hào): | W3E32M64S-200BM |
| 廠商: | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分類: | DRAM |
| 英文描述: | 32M X 64 DDR DRAM, 0.8 ns, PBGA219 |
| 封裝: | 25 X 25 MM, PLASTIC, BGA-219 |
| 文件頁數(shù): | 9/17頁 |
| 文件大?。?/td> | 847K |
| 代理商: | W3E32M64S-200BM |

相關(guān)PDF資料 |
PDF描述 |
|---|---|
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| W7NCF02GH10CS3EG | 128M X 16 FLASH 3.3V PROM CARD, 150 ns, UUC |
| W7NCF04GH10ISA4FM1G | FLASH 3.3V PROM MODULE, XMA50 |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| W3E32M64S-200SBC | 制造商:Microsemi Corporation 功能描述:32M X 64 DDR, 2.5V, 200 MHZ, 208 PBGA, COMMERCIAL TEMP. - Bulk |
| W3E32M64S-200SBI | 制造商:Microsemi Corporation 功能描述:32M X 64 DDR, 2.5V, 200 MHZ, 208 PBGA, INDUSTRIAL TEMP. - Bulk |
| W3E32M64S-200SBM | 制造商:Microsemi Corporation 功能描述:32M X 64 DDR, 2.5V, 200 MHZ, 208 PBGA, MIL-TEMP. - Bulk |
| W3E32M64S-250BC | 制造商:Microsemi Corporation 功能描述:32M X 64 DDR, 2.5V, 250 MHZ, 219 PBGA, COMMERCIAL TEMP. - Bulk |
| W3E32M64S-250BI | 制造商:Microsemi Corporation 功能描述:32M X 64 DDR, 2.5V, 250 MHZ, 219 PBGA, INDUSTRIAL TEMP. - Bulk |