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參數(shù)資料
| 型號(hào)： | W2Z512K72SJ35ES |
| 廠商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分類： | SRAM |
| 英文描述： | 512K X 72 MULTI DEVICE SRAM MODULE, 3.5 ns, PBGA209 |
| 封裝： | PLASTIC, BGA-209 |
| 文件頁數(shù)： | 4/12頁 |
| 文件大小： | 281K |
| 代理商： | W2Z512K72SJ35ES |
12
White Electronic Designs Corporation Westborough, MA (508) 366-5151
W2Z512K72SJ
PACKAGE DIMENSION: 209 BUMP PBGA
ALL LINEAR DIMENSIONS ARE IN MILLIMETERS AND PARENTHETICALLY IN INCHES
ORDERING INFORMATION
Commercial Temp Range (0°C to 70°C), Industrial Temp. Range (-40° to 85°C)
Part Number
ConfigurationtCD
Clock
Operating
(ns)
(MHz)
Range
W2Z512K72SJ35ES
512K x 72
3.5
166
Engineering Samples
W2Z512K72SJ38ES
512K x 72
3.8
150
Engineering Samples
W2Z512K72SJ28BC
512K x 72
2.8
225
Commercial
W2Z512K72SJ30BC
512K x 72
3.0
200
Commercial
W2Z512K72SJ35BC
512K x 72
3.5
166
Commercial
W2Z512K72SJ38BC
512K x 72
3.8
150
Commercial
W2Z512K72SJ30BI
512K x 72
3.0
200
Industrial
W2Z512K72SJ35BI
512K x 72
3.5
166
Industrial
W2Z512K72SJ38BI
512K x 72
3.8
150
Industrial
NOTE: Ball attach pad for above BGA package is 620 microns in diameter. Pad is solder mask defined.
2.50 (0.099)
MAX
0.600 (0.024)
MAX
1.27 (0.050)
TYP
1.00 TYP
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
14.00 (0.551) TYP
A1
CORNER
18.00
TYP
22.00 (0.866)
TYP
10.00 (0.394)
TYP
R 1.52 (0.060)
MAX (4x)
11 10
9
8
7
654
32
1
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