參數(shù)資料
型號(hào): W25Q32BWZPIP
廠商: WINBOND ELECTRONICS CORP
元件分類: PROM
英文描述: 4M X 8 SPI BUS SERIAL EEPROM, DSO8
封裝: 6 X 5 MM, GREEN, WSON-8
文件頁數(shù): 70/72頁
文件大?。?/td> 2212K
代理商: W25Q32BWZPIP
W25Q32BW
- 72 -
14. REVISION HISTORY
VERSION
DATE
PAGE
DESCRIPTION
A
08/24/08
New Create Preliminary
B
03/13/09
19, 31, 33, 36,
69 & 70
20, 54~56
69
32,33
14
Added Set Burst with Wrap Opcode 77h
Modified Continuous Read Mode Bit settings
Updated Ordering Information
Added Security Register 0 Note.
Add note 2b.
Typo M6-5 to W6-5
QE pin to QE bit
C
08/07/09
44, 45
5, 6, 8, 64~69, 70
and 71
52
Updated Erase/Program Suspend, Resume
Description.
Update Package Diagrams
Added Package WSON8 8x6-mm
Added Special Order context.
UID Waveform Correction
D
10/07/09
Table of Contents Error Correction
E
07/08/10
57 & 61
Updated AC parameters
Preliminary Designation
The “Preliminary” designation on a Winbond datasheet indicates that the product is not fully
characterized. The specifications are subject to change and are not guaranteed. Winbond or an
authorized sales representative should be consulted for current information before using this product.
Trademarks
Winbond and SpiFlash are trademarks of Winbond Electronics Corporation.
All other marks are the property of their respective owner.
Important Notice
Winbond products are not designed, intended, authorized or warranted for use as components in systems
or equipment intended for surgical implantation, atomic energy control instruments, airplane or spaceship
instruments, transportation instruments, traffic signal instruments, combustion control instruments, or for
other applications intended to support or sustain life. Further more, Winbond products are not intended
for applications wherein failure of Winbond products could result or lead to a situation wherein personal
injury, death or severe property or environmental damage could occur.
Winbond customers using or selling these products for use in such applications do so at their own risk
and agree to fully indemnify Winbond for any damages resulting from such improper use or sales.
相關(guān)PDF資料
PDF描述
W949D2CBJX5E 16M X 32 DDR DRAM, 5 ns, PBGA90
WF128K32N-150HC5 512K X 8 FLASH 5V PROM MODULE, 150 ns, HIP66
WPS512K8LB-85GM 512K X 8 STANDARD SRAM, 85 ns, PDSO32
WPS128K32GV-17PJI 512K X 8 MULTI DEVICE SRAM MODULE, 17 ns, PQMA68
WF2M32B-150HM5 8M X 8 FLASH 5V PROM MODULE, 150 ns, CHIP66
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
W25Q32DW 制造商:WINBOND 制造商全稱:Winbond 功能描述:1.8V 32M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI
W25Q32DWSFIG 功能描述:IC FLASH SPI 32MBIT 16SOIC RoHS:是 類別:集成電路 (IC) >> 存儲(chǔ)器 系列:SpiFlash® 標(biāo)準(zhǔn)包裝:2,500 系列:- 格式 - 存儲(chǔ)器:EEPROMs - 串行 存儲(chǔ)器類型:EEPROM 存儲(chǔ)容量:1K (128 x 8) 速度:100kHz 接口:UNI/O?(單線) 電源電壓:1.8 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-TSSOP,8-MSOP(0.118",3.00mm 寬) 供應(yīng)商設(shè)備封裝:8-MSOP 包裝:帶卷 (TR)
W25Q32DWSFIP 制造商:WINBOND 制造商全稱:Winbond 功能描述:1.8V 32M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI
W25Q32DWSSIG 功能描述:IC FLASH SPI 32MBIT 8SOIC RoHS:是 類別:集成電路 (IC) >> 存儲(chǔ)器 系列:SpiFlash® 標(biāo)準(zhǔn)包裝:2,500 系列:- 格式 - 存儲(chǔ)器:EEPROMs - 串行 存儲(chǔ)器類型:EEPROM 存儲(chǔ)容量:1K (128 x 8) 速度:100kHz 接口:UNI/O?(單線) 電源電壓:1.8 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-TSSOP,8-MSOP(0.118",3.00mm 寬) 供應(yīng)商設(shè)備封裝:8-MSOP 包裝:帶卷 (TR)
W25Q32DWSSIP 制造商:WINBOND 制造商全稱:Winbond 功能描述:1.8V 32M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI