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參數(shù)資料
| 型號(hào)： | VSC8164QR |
| 廠商： | VITESSE SEMICONDUCTOR CORP |
| 元件分類： | 數(shù)字傳輸電路 |
| 英文描述： | AA/9V REMOTE ALMOND BOX |
| 中文描述： | MUX/DEMUX, PQFP128 |
| 封裝： | 14 X 20 MM, HEAT SINK, PLASTIC, QFP-128 |
| 文件頁數(shù)： | 13/16頁 |
| 文件大小： | 153K |
| 代理商： | VSC8164QR |
VITESSE
Preliminary Datasheet
VSC8164
2.488 Gbit/sec to 2.7Gbit/sec
1:16 SONET/SDH Demux
Page 13
VITESSE
SEMICONDUCTOR CORPORATION
741 Calle Plano, Camarillo, CA 93012
805/388-3700
FAX: 805/987-5896
G52239-0, Rev. 3.3
5/17/00
Package Thermal Considerations
This package has been enhanced with a copper heat slug to provide a low thermal resistance path from the
die to the exposed surface of the heat spreader. The thermal resistance is shown in the following table
Table 4: Thermal Resistance
Thermal Resistance with Airflow
Shown in the table below is the thermal resistance with airflow. This thermal resistance value reflects all the
thermal paths including through the leads in an environment where the leads are exposed. The temperature dif-
ference between the ambient airflow temperature and the case temperature should be the worst case power of
the device multiplied by the thermal resistance.
Table 5: Thermal Resistance with Airflow
Maximum Ambient Temperature without Heatsink
The worst case ambient temperature without use of a heatsink is given by the equation:
where:
θ
CA
Theta case to ambient at appropriate airflow
Τ
A(MAX)
Ambient Air temperature
Τ
C(MAX
)
Case temperature (85
o
C for VSC8164)
P
(MAX)
Power (1.1 W for VSC8164)
Symbol
Description
°
C/W
θ
jc
Thermal resistance from
junction to case.
Thermal resistance from case to
ambient with no airflow,
including conduction through
the leads.
1.34
θ
ca
25.0
Airflow
θ
ca
(
o
C/W
)
21
18
16
14.5
100 lfpm
200 lfpm
400 lfpm
600 lfpm
T
A MAX
)
T
C MAX
)
P
–
MAX
(
)
θ
CA
=
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