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參數(shù)資料
| 型號(hào)： | VSC7129 |
| 廠商： | Vitesse Semiconductor Corporation. |
| 英文描述： | Toggle Switch; No. of Switch Positions:10; Circuitry:SPST; Contact Current Max:1.5A; Mounting Type:PCB; Number of Positions:10; Switch Function:SPST |
| 中文描述： | 家庭的中繼/重定時(shí)器和端口旁路電路的光纖通道 |
| 文件頁(yè)數(shù)： | 11/12頁(yè) |
| 文件大小： | 174K |
| 代理商： | VSC7129 |
Data Sheet
VSC7127/VSC7129
Family of Repeater/Retimer and Port
Bypass Circuits for Fibre Channel
G52298-0, Rev 4.3
05/01/01
Page 11
VITESSE
SEMICONDUCTOR CORPORATION
741 Calle Plano
Camarillo, CA 93012
Tel: (800) VITESSE
FAX: (805) 987-5896
Email: prodinfo@vitesse.com
Internet: www.vitesse.com
VITESSE
Package Thermal Characteristics
The VSC7127/VSC7129 is packaged in a standard plastic quad flatpack, PQFP, with an embedded, but
unexposed thermal heatslug. This package adheres to industry-standard EIAJ footprints for a 10 mm body, 44
lead PQFP. The package construction is as shown in Figure 6. The 44 PQFP with embedded slug has the thermal
properties shown in Figure 6.
Figure 6: Package Cross Section
—
10 mm package
Table 5: 44 PQFP Thermal Resistance
The VSC7127/VSC7129 is designed to operate with a case temperature up to 95
o
C. The user must guaran-
tee that the case temperature specification is not violated. With the thermal resistances shown in Table 5, the
10mm PQFP can operate in still air ambient temperatures of 50
o
C [50
o
C = 95
o
C - 0.9W * 50]. If the ambient air
temperature exceeds these limits, some form of cooling through a heatsink or an increase in airflow must be pro-
vided.
Moisture Sensitivity Level
This device is rated at a Moisture Sensitivity Level 3 rating with maximum floor life of 168 hours at 30
o
C,
60% relative humidity. Please refer to Application Note AN-20 for appropriate handling procedures.
Symbol
Description
Value
Units
θ
CA-0
θ
CA-100
θ
CA-200
θ
CA-400
θ
CA-600
Thermal resistance from case-to-ambient, still air
Thermal resistance from case-to-ambient, 100 LFPM air
Thermal resistance from case-to-ambient, 200 LFPM air
Thermal resistance from case-to-ambient, 400 LFPM air
Thermal resistance from case-to-ambient, 600 LFPM air
50
43
39
36
34
o
C/W
o
C/W
o
C/W
o
C/W
o
C/W
Copper Heat Spreader
Die
Plastic Molding Compound
Lead
Bond Wire
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