參數(shù)資料
型號(hào)： VSC7105QF
廠商： VITESSE SEMICONDUCTOR CORP
元件分類： 通信及網(wǎng)絡(luò)
英文描述： SPECIALTY TELECOM CIRCUIT, PQFP44
封裝： 14 X 14 MM, HEAT SPREADER, PLASTIC, QFP-44
文件頁(yè)數(shù)： 16/26頁(yè)
文件大小： 185K
代理商： VSC7105QF
VITESSE Semiconductor Cororation
Page 23
VSC7105/7106
Data Sheet
1.0625 Gbit/sec Transmitter/Receiver Chipset
for Fibre Channel or Proprietary Serial Links
G52079-0 Rev. 2.7
VITESSE
Package Thermal Characteristics
The VSC7105 and VSC7106 are packaged into thermally enhanced plastic quad atpacks. These packages
use industry standard EIAJ footprints, but have been enhanced to improve thermal dissipation through low ther-
mal resistance paths from the die to the exposed surface of the heat spreader and from the die to the leadframe
through the heat spreader overlap of the leadframe. The construction of the package is as shown in Figure 16.
Figure 16: Package Cross Section
Table 9: 44 and 52 PQFP Thermal Resistance
*Note: Includes conduction through the leads of the package for a non-thermally saturated board.
The VSC7105 and VSC7106 are designed to operate with at a case temperature up to 90oC. The user must
guarantee that the case temperature specication is not violated. Given the thermal resistance of the package in
still air, the user can operate the VSC7106 in still air if the ambient temperature does not exceed 36oC on a non-
thermally saturated board.
If the user’s environment exceeds 36oC, then the user must either provide adequate airow, attach a heat
sink, or both. Below is an example to guide the user in determining these requirements with additional airow
and with adding a heatsink.
Symbol
Description
44-pin Value
Units
θ
jc
Thermal resistance from junction to case
2.1
oC/W
θ
ca-0
Thermal resistance from case to ambient, still air*
30
oC/W
θ
ca-100
Thermal resistance from case to ambient, 100 LFPM air*
24
oC/W
θ
ca-200
Thermal resistance from case to ambient, 200 LFPM air*
21
oC/W
θ
ca-300
Thermal resistance from case to ambient, 300 LFPM air*
19
oC/W
θ
ca-500
Thermal resistance from case to ambient, 500 LFPM air*
15
oC/W
Lead
Copper Heat Spreader
Die
Plastic Molding Compound
Insulator
Wire Bond
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
VSC7106QF 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Telecommunication IC
VSC7108 制造商:VITESSE 制造商全稱:Vitesse Semiconductor Corporation 功能描述:Quad Signal Conditioner, Octal Signal Conditioner
VSC7108VP-01 功能描述:IC SIGNAL COND 8X8 69-BGA RoHS:否 類別:集成電路 (IC) >> 接口 - 電信 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS 產(chǎn)品變化通告:Product Discontinuation 06/Feb/2012 標(biāo)準(zhǔn)包裝:750 系列:*
VSC7108XVP-01 功能描述:IC SIGNAL COND OCTAL 69-BGA RoHS:是 類別:集成電路 (IC) >> 接口 - 電信 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS 產(chǎn)品變化通告:Product Discontinuation 06/Feb/2012 標(biāo)準(zhǔn)包裝:750 系列:*
VSC7111 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Telecommunication IC
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