
For technical questions in the Americas, contact foilsupport1@vishay.com
For technical questions in Asia/Japan/Europe/Africa/Israel, contact foilsupport2@vishay.com
Document Number: 63023
Revision 26-Jan-05
www.vishay.com
32
VCS2516
Vishay Foil Resistors
S
ISRAEL: foilsales.israel@vishay.com FRANCE/SWITZERLAND/SOUTHERN EUROPE: foilsales.eusouth@vishay.com AMERICAS: foilsales.usa@vishay.com
ASIA/JAPAN: foilsales.asia@vishay.com UK/HOLLAND/SCANDINAVIA: foilsales.eunorth@vishay.com GERMANY/CZECH REPUBLIC/AUSTRIA: foilsales.eucentral@vishay.com
SALES
Bulk Metal
Foil Technology
Surface Mount Current Sensing Chip Resistors
FEATURES
Low Ohmic Values: 0.01
to 1.0
Low Temperature Coefficient of Resistance (TCR):
10ppm/
°
C, nominal (- 55
°
C to + 125
°
C, + 25
°
C Ref.)
Tight Resistance Tolerance: to
±
0.1%
High Power Rating: 1 watt at + 85
°
C
Current Rating: 5 Amperes maximum
Low Thermal EMF: 0.05
μ
V/
°
C typical
Low Current Noise: - 40dB
Low Voltage Coefficient: < 0.1ppm/V
Non Inductive: < 0.08
μ
H
INTRODUCTION
Model VCS2516 are surface mount resistors designed with
4 pads for kelvin connection. Utilizing Vishay Bulk Metal
Foil as the resistance element, they provide performance
capabilities far greater than other resistor technologies can
supply in a product of comparable size.
These small devices dissipate the heat almost entirely
through the pads so surface mount users are encouraged to
be generous with the pads and board traces. Some hybrid
users may want to use conductive epoxy for the
interconnection and gold terminations are available on
special order. (Tin/lead oxidizes on the surface and the
conductive epoxy joint eventually fails electrically.)
Lead (Pb)-free terminations (100% Sn) are also availiable.
Our Application Engineering Department is prepared to
advise and to make recommendations for non standard
technical requirements and special applications, Please
contact us.
Product may not
be to scale
TERMINATIONS
Lead (Pb)-free two options are available:
Gold Plated
Tin Plated
Tin/Lead (Sn 60% Pb 40%) Plated
APPLICATIONS
Automatic test equipment (ATE)
Airborne (in heads-up display systems)
High precision instrumentation
Electron beam recording equipment
Electron microscopes
Current sensing applications
Forced balance electronic scales
Applications that require superior frequency stability etc.
FIGURE 1 - DIMENSIONS
in inches and millimeters
L
H
W
A
B
I2
I1
E1
E2
DIMENSIONS
INCHES
mm
L
0.250
±
0.010
6.35
±
0.25
H
0.160
±
0.010
4.06
±
0.25
W
0.040 maximum
1.02 maximum
A
0.080
±
0.005
2.03
±
0.13
B
0.040
±
0.010
1.02
±
0.25
.
(
.
(
.070
.260
(6.60)
(1.78)
I
1
E
1
I
2
E
2
Solder Pad Layout
Electrical
Schematic
R
Top View
Bottom View
Mounting
Pads (4)
R
1
R
2
Vin
Vout
-
+