
ABSOLUTE MAXIMUM RATINGS
(1)
DISSIPATION RATINGS
(1)
RECOMMENDED OPERATING CONDITIONS
www.ti.com .............................................................................................................................................................. SLVS630C – APRIL 2007 – REVISED MAY 2008
This device contains circuits to protect its inputs and outputs against damage due to high static voltages or electrostatic fields.
These circuits have been qualified to protect this device against electrostatic discharges; HBM according to EIA/JESD22-A114-B,
MM according EIA/JESD22-A115-A, and CDM according EIA/JESD22C101C; however, it is advised that precautions be taken to
avoid application of any voltage higher than maximum-rated voltages to these high-impedance circuits. During storage or handling
the device leads should be shorted together or the device should be placed in conductive foam. In a circuit, unused inputs should
always be connected to an appropriate logic voltage level, preferably either VCC or ground. Specific guidelines for handling devices
of this type are contained in the publication Guidelines for Handling Electrostatic-Discharge-Sensitive (ESDS) Devices and
Assemblies available from Texas Instruments.
ORDERING INFORMATION(1)
TA
PLASTIC QFN
OUTPUT
LBI/LBO
MARKING
16 PIN (RSA) (2)(3)
VOLTAGE
FUNCTIONALITY
TPS62110MRSAREP
Adjustable
Standard
TPS62110-EP
1.2 V to 16 V
–55°C to 125°C
TPS62111MRSAREP
3.3 V
Standard
TPS62111-EP
TPS62112MRSAREP
5 V
Standard
TPS62112-EP
(1)
For the most current package and ordering information, see the Package Option Addendum at the end
of this document, or see the TI website at
www.ti.com.
(2)
(3)
The RSA package is available in tape and reel. Add R suffix (TPS62110RSAR) to order quantities of
3000 parts per reel. Add T suffix (TPS62110RSAT) to order quantities of 250 parts per reel
over operating free-air temperature range (unless otherwise noted)
UNIT
VCC
Supply voltage at VIN, VINA
–0.3 V to 20 V
Voltage at SW
–0.3 V to VI
VI
Voltage at EN, SYNC, LBO, PG
–0.3 V to 20 V
Voltage at LBI, FB
–0.3 V to 7 V
IO
Output current at SW
2400 mA
TJ
Maximum junction temperature
150°C
Tstg
Storage temperature
–65°C to 150°C
Lead temperature 1,6 mm (1/16-inch) from case for 10 seconds
300°C
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
TA ≤ 25°C
DERATING FACTOR
TA = 70°C
TA = 85°C
PACKAGE
POWER RATING
ABOVE TA = 25°C
POWER RATING
RSA
2.5 W
25 mW/°C
1.375 W
1 W
(1)
Based on a thermal resistance of 40 K/W soldered onto a high K board.
MIN
MAX
UNIT
VCC
Supply voltage at VIN, VINA
3.1
17
V
Maximum voltage at power-good, LBO, EN, SYNC
17
V
TJ
Operating junction temperature
–55
125
°C
Copyright 2007–2008, Texas Instruments Incorporated
3