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參數(shù)資料
| 型號： | UPD75P116CW |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 4-BIT, OTPROM, MICROCONTROLLER, PDIP64 |
| 封裝： | 0.750 INCH, SHRINK, PLASTIC, DIP-64 |
| 文件頁數(shù)： | 21/32頁 |
| 文件大?。?/td> | 286K |
| 代理商： | UPD75P116CW |
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PD75P116
6.
RECOMMENDED SOLDERING CONDITIONS
The
PD75P116 should be mounted under the conditions recommended in the table below.
For details of recommended soldering conditions, refer to the information document “Surface Mount Techno-
logy Manual” (IEI-1207).
For soldering methods and conditions other than those recommended below, contact our salesman.
Table 6-1 Surface Mount Type Soldering Conditions
PD75P116GF-3BE : 64-pin plastic QFP (14 × 20 mm)
Infrared reflow
Pin part heating
—
VP15-162-1
WS60-162-1
IR30-162-1
VPS
Recommended
Condition Symbol
Soldering Conditions
Soldering Method
Package peak temperature: 230
°C, Duration: 30 sec. max.
(at 210
°C or above), Number of times: Once
Time limit: 2 days* (thereafter 16 hours prebaking required
at 125
°C)
Package peak temperature: 215
°C, Duration: 40 sec. max.
(at 200
°C or above), Number of times: Once
Time limit: 2 days* (thereafter 16 hours prebaking required
at 125
°C)
Solder bath temperature: 260
°C max., Duration: 10 sec. max
Number of times: Once
Preheating temperature: 120
°C max. (package surface
temperature),
Time limit: 2 days* (thereafter 16 hours prebaking required
at 125
°C)
Pin part temperature: 300
°C max., Duration: 3 sec. max.
(per device side)
Wave soldering
*
For the storage period after dry-pack decapsulation, storage conditions are max. 25
°C, 65% 1H.
Note
Use of more than one soldering method should be avoided (except in the case of pin part heating).
Note
Ensure that the application of (wave soldering) is limited to the lead part and no solder touches
the main unit directly.
Table 6-2 Insertion Type Soldering Conditions
PD75P116CW : 64-pin plastic shrink DIP (750 mil)
5
Soldering Method
Soldering Conditions
Wave Soldering (lead part only)
Pin part heating
Solder bath temperature: 260
°C max., Duration: 10sec. max.
Pin part temperature: 260
°C max., Duration: 10sec. max.
Notice
A version of this product with improved recommended soldering conditions is available. For details
(improvements such as infrared reflow peak temperature extension (230
°C), number of times: twice,
relaxation of time limit, etc.), contact NEC sales personnel.
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相關代理商/技術參數(shù) |
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|---|---|
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