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參數資料
| 型號： | UPD72874GC-YEB |
| 廠商： | NEC Corp. |
| 英文描述： | IEEE1394 OHCI 1.1 COMPLIANT 3PORT PHY-LINK 1-CHIP HOST CONTROLLER |
| 中文描述： | IEEE1394連接的OHCI 1.1標準3PORT物理層鏈路1 -芯片的主機控制器 |
| 文件頁數： | 7/40頁 |
| 文件大?。?/td> | 297K |
| 代理商： | UPD72874GC-YEB |
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Preliminary Data Sheet S15306EJ2V0DS
7
μ
PD72874
4. PHY FUNCTION.................................................................................................................................... 29
4.1 Cable Interface............................................................................................................................... 29
4.1.1 Connections .........................................................................................................................................29
4.1.2 Cable Interface Circuit..........................................................................................................................30
4.1.3 CPS......................................................................................................................................................30
4.1.4 Unused Ports........................................................................................................................................30
4.2 PLL and Crystal Oscillation Circuit ............................................................................................. 30
4.2.1 Crystal Oscillation Circuit .....................................................................................................................30
4.2.2 PLL.......................................................................................................................................................30
4.3 PC0 to PC2 ..................................................................................................................................... 30
4.4 P_RESET ........................................................................................................................................ 30
4.5 RI0, RI1 ........................................................................................................................................... 30
5. ELECTRICAL SPECIFICATIONS......................................................................................................... 31
6. PACKAGE DRAWING.......................................................................................................................... 34
7. RECOMMENDED SOLDERING CONDITIONS................................................................................... 35
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