參數(shù)資料
型號： UPC1854ACT
廠商： NEC Corp.
英文描述： I2C BUS-COMPATIBLE US MTS PROCESSING LSI
中文描述： I2C總線兼容美國的多邊貿(mào)易體制處理LSI
文件頁數(shù)： 5/48頁
文件大?。?/td> 251K
代理商： UPC1854ACT
μ
PC1854A
5
Data Sheet S12816EJ3V0DS00
CONTENTS
1.
PIN EQUIVALENT CIRCUITS.............................................................................................................................. 6
2.
BLOCK FUNCTIONS.......................................................................................................................................... 13
2.1
Stereo Demodulation Block..................................................................................................................... 14
2.2
SAP Demodulation Block ........................................................................................................................ 15
2.3
dbx Noise Reduction Block ..................................................................................................................... 16
2.4
Matrix Block.............................................................................................................................................. 17
3.
I
2
C BUS INTERFACE......................................................................................................................................... 18
3.1
Data Transfer ........................................................................................................................................... 19
3.2
Data Transfer Format .............................................................................................................................. 20
4.
I
2
C BUS COMMANDS ........................................................................................................................................ 22
4.1
Subaddress List ....................................................................................................................................... 22
4.2
Setting Procedure .................................................................................................................................... 23
4.3
Explanation of Write Register.................................................................................................................. 25
4.4
Explanation of Read Register ................................................................................................................. 28
5.
MODE MATRIX ................................................................................................................................................... 30
5.1
L-, R-Channel Output (LOT, ROT pins) Matrix....................................................................................... 30
5.2
Normal Output (NOT pin) Matrix ............................................................................................................. 31
6.
USAGE CAUTIONS ............................................................................................................................................ 32
6.1
Caution on Shock Noise Reduction ........................................................................................................ 32
6.2
Supply Voltage ......................................................................................................................................... 32
6.3
Impedance of Input and Output Pins ...................................................................................................... 32
6.4
Drive Capability of Output Pins ............................................................................................................... 32
6.5
Caution on External Components ........................................................................................................... 33
6.6
Change of Electrical Characteristics by External Components ............................................................. 33
7.
ELECTRICAL SPECIFICATIONS ...................................................................................................................... 34
8.
MEASURING CIRCUIT....................................................................................................................................... 44
9.
PACKAGE DRAWINGS ..................................................................................................................................... 45
10. RECOMMENDED SOLDERING CONDITIONS ................................................................................................ 47
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