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參數(shù)資料
| 型號： | UPC1854ACT |
| 廠商： | NEC Corp. |
| 英文描述： | I2C BUS-COMPATIBLE US MTS PROCESSING LSI |
| 中文描述： | I2C總線兼容美國的多邊貿易體制處理LSI |
| 文件頁數(shù)： | 47/48頁 |
| 文件大?。?/td> | 251K |
| 代理商： | UPC1854ACT |
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μ
PC1854A
47
Data Sheet S12816EJ3V0DS00
10. RECOMMENDED SOLDERING CONDITIONS
The
μ
PC1854A should be soldered and mounted under the conditions recommended in the table below.
For details of recommended soldering conditions, refer to the information document
Semiconductor Device
Mounting Technology Manual (C10535E)
.
For soldering methods and conditions other than those recommended below, contact an NEC sales representa-
tive.
Table 10-1. Surface Mounting Type Soldering Conditions
μ
PC1854AGT : 28-pin plastic SOP (9.53 mm (400))
Soldering Method
Soldering Conditions
Symbol
Infrared reflow
Package peak temperature: 235
°
C, Duration: 30 sec. max. (at 210
°
C or above),
Number of times: Three times max.
IR35-00-3
VPS
Package peak temperature: 215
°
C, Duration: 40 sec. max. (at 200
°
C or above),
Number of times: Three times max.
VP15-00-3
Wave soldering
Solder bath temperature: 260
°
C max., Duration: 10 sec. max., Number of times: Once,
Preliminary heat temperature: 120
°
C max. (Package surface temperature)
WS60-00-1
Partial heating
Pin temperature: 300
°
C max., Duration: 3 sec. max. (per pin row)
—
Caution
Do not use different soldering methods together (except in the case of partial heating).
Table 10-2. Inserting Type Soldering Conditions
μ
PC1854ACT : 28-pin plastic SDIP (10.16 mm (400))
Soldering Method
Soldering Conditions
Wave soldering
(only pins)
Solder bath temperature: 260
°
C max., Duration: 10 sec. max.
Partial heating
Pin temperature: 300
°
C max., Duration: 3 sec. max. (per pin row)
Caution
Apply wave soldering only to the pins and be careful not to bring solder into direct contact
with the package.
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