參數(shù)資料
型號: UPC177GR-9LG-E2-A
廠商: NEC Corp.
英文描述: BIPOLAR ANALOG INTEGRATED CIRCUIT SINGLE POWER SUPPLY QUAD COMPARATORS
中文描述: 雙極模擬集成電路單電源供電四比較器
文件頁數(shù): 9/10頁
文件大?。?/td> 200K
代理商: UPC177GR-9LG-E2-A
Data Sheet G17933EJ3V0DS
9
μ
PC177GR-9LG,
μ
PC339GR-9LG
RECOMMENDED SOLDERING CONDITIONS
The
μ
PC177GR-9LG,
μ
PC339GR-9LG should be soldered and mounted under the following recommended
conditions.
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
representative.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Type of Surface Mount Device
μ
PC177GR-9LG-A
Note
,
μ
PC177GR(5)-9LG-A
Note
,
μ
PC339GR-9LG-A
Note
,
μ
PC339GR(5)-9LG-A
Note
: 14-pin plastic TSSOP (5.72 mm (225))
Process
Conditions
Symbol
Infrared ray reflow
Peak temperature: 260
°
C, Reflow time: 60 seconds or less (at 220
°
C or higher),
Maximum number of reflow processes: 3 times.
IR60-00-3
Wave soldering
Solder temperature: 260
°
C or below, Flow time: 10 seconds or less, Maximum
number of flow processes: 1 time,
Pre-heating temperature: 120
°
C or below (Package surface temperature).
WS60-00-1
Partial heating method
Pin temperature: 350
°
C or below,
Heat time: 3 seconds or less (Per each side of the device).
P350
Note
Pb-free (This product does not contain Pb in external electrode and other parts.)
Caution Apply only one kind of soldering condition to a device, except for “partial heating method”, or the
device will be damaged by heat stress.
Remark
Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended.
REFERENCE DOCUMENTS
Document Name
Document No.
QUALITY GRADES ON NEC SEMICONDUCTOR DEVICES
C11531E
SEMICONDUCTOR DEVICE MOUNT MANUAL
http://www.necel.com/pkg/en/mount/index.html
NEC SEMICONDUCTOR DEVICE RELIABILITY/QUALITY CONTROL
SYSTEM-STANDARD LINEAR IC
IEI-1212
REVIEW OF QUALITY AND RELIABILITY HANDBOOK
C12769E
NEC SEMICONDUCTOR DEVICE RELIBIALITY/QUALITY CONTROL
SYSTEM
C10983E
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