參數(shù)資料
型號(hào)： UAA3545
廠商： NXP Semiconductors N.V.
英文描述： Fully integrated DECT transceiver
中文描述： 收發(fā)器完全集成的DECT
文件頁(yè)數(shù)： 10/28頁(yè)
文件大?。?/td> 116K
代理商： UAA3545
2001 Sep 06
10
Philips Semiconductors
Product specification
Fully integrated DECT transceiver
UAA3545
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
Note
1.
Ground pins must be short-circuited externally (this is in addition to being short-circuited internally.
HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling MOS devices.
All pins are compatible with “EIA/JESD22-A114-A Class1 (October 1997)”
LATCH-UP
Pins S_DATA, TXA and TXB are susceptible to latch-up if a negative current greater than 20 mA is drawn from the
respective pin (occurs when the pin voltage is negative with respect to GND).
To avoid latch-up, pins TXA and TXB pins must be connected to V
CC
through coils, and the S_DATA control signal input
from the baseband IC must be kept positive with respect to GND.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
CC(syn)
,
V
CC(reg)
,
V
CC(RX)
,
V
CC(TX)
V
n
P
i(RFA)(max)
,
P
i(RFB)(max)
GND
supply voltage
All V
CC
supplies must be at
the same potential (V
CC
)
0.3
+3.6
V
voltage on any pin
maximum input power at
pins RFA and RFB
difference in ground supply voltage
applied between all ground pins
total power dissipation
storage temperature
ambient temperature
junction temperature
0.3
V
CC
15
V
dBm
note 1
0.01
V
P
tot
T
stg
T
amb
T
j
55
10
300
+125
+60
150
mW
°
C
°
C
°
C
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
R
th(j-a)
thermal resistance from junction to ambient
in free air
100
K/W
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