參數(shù)資料
型號(hào): TZA3023
廠商: NXP Semiconductors N.V.
元件分類: 跨阻放大器
英文描述: SDH/SONET STM4/OC12 transimpedance amplifier
中文描述: SDH / SONET的STM4/OC12阻放大器
文件頁(yè)數(shù): 7/24頁(yè)
文件大?。?/td> 191K
代理商: TZA3023
2000 Mar 29
7
Philips Semiconductors
Product specification
SDH/SONET STM4/OC12
transimpedance amplifier
TZA3023
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
HANDLING
Precautions should be taken to avoid damage through electrostatic discharge. This is particularly important during
assembly and handling of the bare die. Additional safety can be obtained by bonding the V
CC
and GND pads first, the
remaining pads may then be bonded to their external connections in any order.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
MIN.
MAX.
UNIT
V
CC
V
n
supply voltage
DC voltage
pin 3/pad 4: IPhoto
pins 6 and 7/pads 9 and 10: OUT and OUTQ
pad 13: AGC (TZA3023U only)
pin 1/pad 1: DREF
DC current
pin 3/pad 4: IPhoto
pins 6 and 7/pads 9 and 10: OUT and OUTQ
pad 13: AGC (TZA3023U only)
pin 1/pad 1: DREF
total power dissipation
storage temperature
junction temperature
ambient temperature
0.5
+6
V
0.5
0.5
0.5
0.5
+1
V
CC
+ 0.5
V
CC
+ 0.5
V
CC
+ 0.5
V
V
V
V
I
n
1
15
0.2
2.5
65
40
+2.5
+15
+0.2
+2.5
300
+150
125
+85
mA
mA
mA
mA
mW
°
C
°
C
°
C
P
tot
T
stg
T
j
T
amb
SYMBOL
PARAMETER
VALUE
UNIT
R
th(j-a)
thermal resistance from junction to ambient
160
K/W
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