參數(shù)資料
型號(hào): TSML3710
廠商: Vishay Intertechnology,Inc.
英文描述: GaAs/GaAlAs Infrared Emitting Diode in SMT Package
中文描述: 砷化鎵/ GaAlA紅外發(fā)光二極管封裝在SMT
文件頁數(shù): 6/8頁
文件大?。?/td> 246K
代理商: TSML3710
www.vishay.com
6
Document Number 81075
Rev. 3, 06-Jun-03
VISHAY
TSML3710
Vishay Semiconductors
Temperature - Time Profile
Drypack
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a des-
iccant.
Floor Life
Floor life (time between soldering and removing from
MBB) must not exceed the time indicated in
J-STD-020.
TSML 3710 is released for:
Moisture Sensitivity Level 2, according to JEDEC,
J-STD-020
Floor Life: 1 year
Conditions: Tamb < 30°C, RH < 60%
Drying
In case of moisture absorption devices should be
baked before soldering. Conditions see J-STD-020 or
Label.
Devices taped on reel dry using recommended condi-
tions 192 h @ 40°C (+ 5°C), RH < 5%
Figure 11. Infrared Reflow Soldering Optodevices (SMD Package)
max. 160 C
full line
dotted line : process limits
: typical
Time ( s )
T
Lead Temperature
90 s - 120 s
300
250
200
150
100
50
00
50
100
150
200
250
max. 240 C
ca. 230 C
10 s
215 C
max 40 s
2 K/s - 4 K/s
94 8625
°
°
Figure 12. Blister Tape
Figure 13. Tape Dimensions in mm for PLCC-2
Adhesive Tape
Component Cavity
Blister Tape
94 8670
1.85
1.65
4.0
3.6
3.6
3.4
2.05
1.95
1.6
1.4
4.1
3.9
4.1
3.9
5.75
5.25
8.3
7.7
3.5
3.1
2.2
2.0
0.25
94 8668
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