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參數(shù)資料
| 型號(hào)： | TPS799XXDDC |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | 200mA, Low Quiescent Current, Ultra-Low Noise, High PSRR Low Dropout Linear Regulator |
| 中文描述： | 200mA的，低靜態(tài)電流，超低噪聲，高PSRR低壓降線性穩(wěn)壓器 |
| 文件頁數(shù)： | 12/21頁 |
| 文件大?。?/td> | 453K |
| 代理商： | TPS799XXDDC |
www.ti.com
Thermal Protection
Thermal protection disables the output when the
junction temperature rises to approximately +165
°
C,
allowing the device to cool. When the junction
temperature cools to approximately +145
°
C the
output circuitry is again enabled. Depending on
power dissipation, thermal resistance, and ambient
temperature, the thermal protection circuit may cycle
on and off. This cycling limits the dissipation of the
regulator,
protecting
it
overheating.
Power Dissipation
The ability to remove heat from the die is different for
each
package
type,
considerations in the PCB layout. The PCB area
around the device that is free of other components
moves the head from the device to the ambient air.
Performance data for JEDEC low- and high-K boards
are given in the
Dissipation Ratings
table. Using
heavier copper will increase the effectiveness in
removing heat from the device. The addition of
plated through-holes to heat-dissipating layers will
also improve the heatsink effectiveness.
P
D
V
IN
V
OUT
I
OUT
(2)
Package Mounting
Solder
pad
TPS799xx are available from the Texas Instruments'
web site at
www.ti.com
.
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. NanoStar
package configuration.
NanoStar is a trademark of Texas Instruments.
1,427
1,327
1,060
0,960
(d = 0.30 0.05)
0,625 Max
TPS799xx
SBVS056G–JANUARY 2005–REVISED AUGUST 2006
The internal protection circuitry of the TPS799xx has
been
designed
to
protect
conditions. It was not intended to replace proper
heatsinking. Continuously running the TPS799xx into
thermal shutdown will degrade device reliability.
Thermal Information
against
overload
presenting
different
from
damage
due
to
Any tendency to activate the thermal protection
circuit indicates excessive power dissipation or an
inadequate heatsink. For reliable operation, junction
temperature should be limited to +125
°
C maximum.
To estimate the margin of safety in a complete
design (including heatsink), increase the ambient
temperature until the thermal protection is triggered;
use worst-case loads and signal conditions. For good
reliability, thermal protection should trigger at least
+35
°
C
above
the
maximum
condition
of
your
particular
configuration
produces
temperature of +125
°
C at the highest expected
ambient temperature and worst-case load.
Power dissipation depends on input voltage and load
conditions. Power dissipation is equal to the product
of the output current time the voltage drop across the
output pass element, as shown in
Equation 2
:
expected
application.
worst-case
ambient
This
junction
a
footprint
recommendations
for
the
Figure 30. YZU Wafer Chip-Scale Package Dimensions (in mm)
12
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