參數(shù)資料
型號: TPS79628KTTRG3
廠商: Texas Instruments, Inc.
英文描述: ULTRALOW-NOISE, HIGH PSRR, FAST, RF, 1A LOW-DROPOUT LINEAR REGULATORS
中文描述: 超低噪聲,高PSRR,快速,射頻低壓差線性穩(wěn)壓器1A條
文件頁數(shù): 10/33頁
文件大?。?/td> 899K
代理商: TPS79628KTTRG3
www.ti.com
THERMAL INFORMATION
TJ
TA
P
D
max x R
θ
JC
R
θ
CS
R
θ
SA
P
D
max
V
IN(avg)
V
OUT(avg)
I
OUT(avg)
V
IN(avg)
I
(Q)
(4)
A
B
C
T
J
A
R
θ
JC
T
C
B
R
θ
CS
T
A
C
R
θ
SA
(a)
(b)
DDPAK Package
SOT223 Package
CIRCUIT BOARD COPPER AREA
B
A
C
TPS796xx
SLVS351I–SEPTEMBER 2002–REVISED MAY 2006
dissipation. The temperature rise is computed by
multiplying the maximum expected power dissipation
by the sum of the thermal resistances between the
junction and the case (R
θ
), the case to heatsink
(R
θ
CS
), and the heatsink to ambient (R
θ
SA
). Thermal
resistances are measures of how effectively an
object dissipates heat. Typically, the larger the
device, the more surface area available for power
dissipation
and
the
lower
resistance.
The amount of heat that an LDO linear regulator
generates is directly proportional to the amount of
power it dissipates during operation. All integrated
circuits
have
a
maximum
temperature (T
J
max) above which normal operation
is not assured. A system designer must design the
operating environment so that the operating junction
temperature (T
J
) does not exceed the maximum
junction
temperature
(T
J
max).
environmental variables that a designer can use to
improve thermal performance are air flow and
external heatsinks. The purpose of this information is
to aid the designer in determining the proper
operating environment for a linear regulator that is
operating at a specific power level.
allowable
junction
the
object's
thermal
The
two
main
Figure 24
illustrates these thermal resistances for (a)
a SOT223 package mounted in a JEDEC low-K
board, and (b) a DDPAK package mounted on a
JEDEC high-K board.
Equation 5
summarizes the computation:
In general, the maximum expected power (P
)
consumed by a linear regulator is computed as
Equation 4
:
(5)
The R
θ
JC
is specific to each regulator as determined
by its package, lead frame, and die size provided in
the regulator's data sheet. The R
θ
SA
is a function of
the type and size of heatsink. For example,
black
body radiator
type heatsinks can have R
θ
CS
values
ranging from 5
°
C/W for very large heatsinks to
50
°
C/W for very small heatsinks. The R
θ
CS
is a
function of how the package is attached to the
heatsink. For example, if a thermal compound is
used to attach a heatsink to a SOT223 package,
R
θ
CS
of 1
°
C/W is reasonable.
where:
For most TI LDO regulators, the quiescent current is
insignificant compared to the average output current;
therefore, the term V
IN(avg)
×
I
(Q)
can be neglected.
The operating junction temperature is computed by
adding
the
ambient
temperature
increase in temperature due to the regulator's power
V
IN(avg)
is the average input voltage.
V
OUT(avg)
is the average output voltage.
I
OUT(avg)
is the average output current.
I
(Q)
is the quiescent current.
(T
A
)
and
the
Figure 24. Thermal Resistances
10
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