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| 型號(hào)： | TPS68625 |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | ULTRALOW-NOISE, HIGH PSRR, FAST RF 1.5 A LOW-DROPOUT LINEAR REGULATORS |
| 中文描述： | 超低噪聲，高PSRR，快速射頻1.5低壓差線性穩(wěn)壓器 |
| 文件頁數(shù)： | 13/17頁 |
| 文件大?。?/td> | 559K |
| 代理商： | TPS68625 |
www.ti.com
1
0.1
2
3
4
5
1
10
100
PD
Copper Heatsink Area cm
2
T
A
= 55
°
C
No Air Flow
150 LFM
250 LFM
0
0.1
100
120
140
160
180
PCB Copper Area in
2
θ
J
R
C
°
No Air Flow
80
60
40
20
1
10
SOT223 Power Dissipation
The SOT223 package provides an effective means of
managing power dissipation in surface mount appli-
cations. The SOT223 package dimensions are pro-
vided in the
Mechanical Data
section at the end of
the data sheet. The addition of a copper plane
directly underneath the SOT223 package enhances
the thermal performance of the package.
P
D
max
(3.3
2.5) V x 1 A
800 mW
(10)
R
θ
JAmax
(125
55)
°
C 800 mW
87.5
°
C W
0
1
2
3
6
0
25
50
75
100
150
125
T
A
= 25
°
C
T
A
Ambient Temperature
°
C
4
5
4 in
2
PCB Area
0.5 in
2
PCB Area
P
D
TPS78601, TPS78618
TPS78625, TPS78628
TPS78630, TPS78633
SLVS389D–SEPTEMBER 2002–REVISED OCTOBER 2004
From
Equation 6, the maximum power dissipation for a
different ground plane area and a specific ambient
temperature can be computed.
the
data
in
Figure
29
and
rearranging
dissipate 800 mW. The operating environment used
to construct Figure 30 consisted of a board with 1 oz.
copper planes. The package is soldered to a 1 oz.
copper pad on the top of the board. The pad is tied
through thermal vias to the 1 oz. ground plane.
Figure 29. Maximum Power Dissipation vs Copper
Heatsink Area
Figure 30. SOT223 Thermal Resistance vs PCB
Area
From
Equation 6, the maximum power dissipation for a
different ground plane area and a specific ambient
temperature can be computed (see Figure 31).
the
data
in
Figure
30
and
rearranging
To illustrate, the TPS78625 in a SOT223 package
was chosen. For this example, the average input
voltage is 3.3 V, the output voltage is 2.5 V, the
average output current is 1 A, the ambient tempera-
ture 55
°
C, no air flow is present, and the operating
environment is the same as documented below.
Neglecting the quiescent current, the maximum aver-
age power is calculated as shown in Equation 10:
Substituting T
J
max for T
J
into Equation 6 gives
Equation 11:
(11)
From Figure 30,
R
Θ
JA
vs PCB Copper Area
, the
ground plane needs to be 0.55 in
2
for the part to
Figure 31. SOT223 Power Dissipation
13
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