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| 型號： | TPS65171RHAR |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 穩(wěn)壓器 |
| 英文描述： | 4 A SWITCHED CAPACITOR REGULATOR, 900 kHz SWITCHING FREQ-MAX, PQCC40 |
| 封裝： | 6 X 6 MM, GREEN, PLASTIC, MO-220VJJD-2, VQFN-40 |
| 文件頁數(shù)： | 27/46頁 |
| 文件大小： | 3644K |
| 代理商： | TPS65171RHAR |
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(
)
(
dis
OFFE
SS
dis
logic
dis
R
R9 + R10)
(V
V
R11 =
V
R
R9 + R10) V
R
-
+
-
www.ti.com
SLVSA22A – OCTOBER 2009 – REVISED JANUARY 2010
Discharge Resistor at VSS Output
If a discharge resistor Rdis at the VSS output is used to discharge the VSS node faster, the pull down resistor R11
connected to VOFFE must be calculated by following formula to achieve the programmed output voltage at VSS. A
smaller resistor to the calculated one must be used. For example for VSS = -7.5V, VOFFE = -11V and Rdis = 12k
the calculated R11 = 4.98k
and the resistor values 4.7k, 4.3k, and 4.0k can be used.
(45)
Figure 32. Negative Shunt Regulator Block Diagram
Output Capacitor Selection (Negative Shunt Regulator)
For the best output voltage filtering, low ESR ceramic output capacitors are recommended. One 1mF ceramic
output capacitor with a sufficient voltage rating is suitable for most applications. See Table 15 for output capacitor
selection.
Table 15. Output Capacitor Selection (Negative Shunt Regulator)
CAPACITOR
COMPONENT SUPPLIER
1mF/25V
Murata, GRM21BR71E105KA99
1mF/50V
Taiyo Yuden, UMK325BJ105KH
Layout Considerations
PCB layout is an important step in power supply design.
NC pins 5, 8, 22, and 29 should not be connected to GND, if so, the device is not P2P short protected any
more.
The input capacitors should be placed as close as possible to the device. AVIN, VIN1, and VIN2 must be
shorted.
The buffer capacitor C25 must be connected to VL+ and AGND/VL- by a single trace.
The line device, diode, output cap of the buck boost should be kept as short as possible.
For the boost converter the line C3 GND output capacitor GND and PGND1 should be kept short.
For the buck converter the line switch pin SW3, 4 to diode should be kept short.
All lower feedback resistors connected to GND should be placed close to the device.
Switching lines should not be next to feedback lines to avoid coupling.
Use short lines or make sure the lines do not affect other regulating parts for the charge pump switching
connection to SW1,2 because this trace carrys switching waveforms.
The PowerPAD of the QFN package should be soldered to GND and as much as possible thermal vias
should be used to lower the thermal resistance and keep the device cool.
A solid PCB ground plane structure is essential for good device performance.
Place red marked components and lines first and as close as possible to the device. Keep red marked lines
short. Bold marked lines should be wide on the PCB, because these traces carry high currents.
Green marked components can be placed further away.
Copyright 2009–2010, Texas Instruments Incorporated
33
Product Folder Link(s): TPS65171
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