參數(shù)資料
型號(hào): TPS61170DRV
廠商: Texas Instruments, Inc.
英文描述: 1.2A High Voltage Boost Converter in 2x2mm2 QFN Package
中文描述: 1.2A的高電壓升壓轉(zhuǎn)換器2x2mm2 QFN封裝
文件頁數(shù): 4/22頁
文件大?。?/td> 405K
代理商: TPS61170DRV
www.ti.com
PIN ASSIGNMENTS
VIN
CTRL
SW
FB
COMP
GND
TOP VIEW
Thermal
Pad
6-PIN 2mm x 2mm x 0.8mm QFN
TPS61170
SLVS789–NOVEMBER 2007
ELECTRICAL CHARACTERISTICS (continued)
VIN = 3.6 V, CTRL = VIN, T
A
= –40
°
C to 85
°
C, typical values are at T
A
= 25
°
C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
EasyScale TIMING
t
start
t
EOS
t
H_LB
t
L_LB
t
H_HB
t
L_HB
V
ACKNL
t
valACKN
t
ACKN
THERMAL SHUTDOWN
T
shutdown
T
hysteresis
Start time of program stream
End time of program stream
High time low bit
Low time low bit
High time high bit
Low time high bit
Acknowledge output voltage low
Acknowledge valid time
Duration of acknowledge condition
2
2
2
μ
s
μ
s
μ
s
μ
s
μ
s
μ
s
V
μ
s
μ
s
360
180
360
360
180
0.4
Logic 0
Logic 0
Logic 1
Logic 1
Open drain, R
pullup
=15 k
to Vin
See
(2)
See
(2)
2
×
t
H_LB
2
×
t
L_HB
2
2
512
Thermal shutdown threshold
Thermal shutdown threshold hysteresis
160
15
°
C
°
C
(2)
Acknowledge condition active 0, this condition will only be applied if the RFA bit is set. Open drain output, line needs to be pulled high
by the host with resistor load.
TERMINAL FUNCTIONS
TERMINAL
NAME
VIN
SW
GND
FB
I/O
DESCRIPTION
NO.
6
4
3
1
I
I
The input supply pin for the IC. Connect VIN to a supply voltage between 3 V and 18 V.
This is the switching node of the IC. Connect SW to the switched side of the inductor.
Ground
Feedback pin for current. Connect to the center tap of a resistor divider to program the output voltage.
Output of the transconductance error amplifier. Connect an external RC network to this pin to compensate
the regulator.
Control pin of the boost regulator. CTRL is a multi-functional pin which can be used for enable the device
and control the feedback voltage with a PWM signal and digital communications.
The thermal pad should be soldered to the analog ground plane to avoid thermal issue. If possible, use
thermal via to connect to ground plane for ideal power dissipation.
O
I
COMP
2
O
CTRL
5
I
Thermal Pad
4
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Copyright 2007, Texas Instruments Incorporated
Product Folder Link(s):
TPS61170
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