參數(shù)資料
型號: TPS61103RGE
廠商: Texas Instruments, Inc.
英文描述: DUAL-OUTPUT, SINGLE-CELL BOOST CONVERTER
中文描述: 雙輸出,單電池升壓變換器
文件頁數(shù): 25/28頁
文件大?。?/td> 507K
代理商: TPS61103RGE
www.ti.com
SWN
C3
10
μ
F
L1
10
μ
H
R1
R2
VBAT
VOUT
FB
LDOIN
LDOOUT
LDOSENSE
R7
R8
R9
C6
2.2
μ
F
C4
100
μ
F
U1
LBO1
LBO2
PGOOD
PGND
LBI
SKIPEN
ADEN
EN
ENPB
LDOEN
GND
TPS6110XRGE
C5
2.2
μ
F
R3
R6
R5
R4
LBO1
LBO2
PGOOD
LDOOUT
OUTPUT
LDOEN
ENPB
EN
ADEN
SKIPEN
INPUT
R11
R10
THERMAL INFORMATION
PD(MAX)
TJ(MAX)
TA
RJA
150
°
C
155 k W
85
°
C
420 mW
(9)
TPS61100, TPS61103
TPS61106, TPS61107
SLVS411B–JUNE 2002–REVISED APRIL 2004
Figure 36. TPS6110x EVM Circuit Diagram
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires
special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added
heat sinks and convection surfaces, and the presence of other heat-generating components affect the
power-dissipation limits of a given component.
Three basic approaches for enhancing thermal performance are listed below.
Improving the power dissipation capability of the PCB design.
Improving the thermal coupling of the component to the PCB.
Introducing airflow in the system.
The maximum junction temperature (T
J
) of the TPS6110x devices is 150
°
C. The thermal resistance of the 20-pin
TSSOP package (PW) isR
Θ
JA
= 155 K/W (QFN package, RGE, 161 K/W). Specified regulator operation is
assured to a maximum ambient temperature T
A
of 85
°
C. Therefore, the maximum power dissipation is about 420
mW. More power can be dissipated if the maximum ambient temperature of the application is lower.
25
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