參數(shù)資料
型號: TPS61050YZG
廠商: Texas Instruments, Inc.
英文描述: 1.2-A HIGH POWER WHITE LED DRIVER 2-MHz SYNCHRONOUS BOOST CONVERTER WITH I2C COMPATIBLE INTERFACE
中文描述: 1.2 A的高功率白光LED I2C兼容接口的驅(qū)動2 - MHz的同步升壓轉(zhuǎn)換器
文件頁數(shù): 32/45頁
文件大?。?/td> 1033K
代理商: TPS61050YZG
www.ti.com
LAYOUT CONSIDERATIONS
As for all switching power supplies, the layout is an important step in the design, especially at high peak currents
and high switching frequencies. If the layout is not carefully done, the regulator could show stability problems as
well as EMI problems. Therefore, use wide and short traces for the main current path and for the power ground
tracks.
THERMAL INFORMATION
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires
special attention to power dissipation. Many system-dependant issues such as thermal coupling, airflow, added
heat sinks and convection surfaces, and the presence of other heat-generating components affect the
power-dissipation limits of a given component.
Theta JB: 35 CW
°
No Airflow
4
3.5
3
2.5
2
1.5
1
0.5
0
0
100 200 300 400 500 600 700 800 900 1000
Pulse Width - ms
S
t
= 85 C
PCB
°
TPS61050
TPS61052
SLUS525–MARCH 2007
The input capacitor, output capacitor, and the inductor should be placed as close as possible to the IC. Use a
common ground node for power ground and a different one for control ground to minimize the effects of ground
noise. Connect these ground nodes at any place close to one of the ground pins of the IC.
To lay out the control ground, it is recommended to use short traces as well, separated from the power ground
traces. This avoids ground shift problems, which can occur due to superimposition of power ground current and
control ground current.
Three basic approaches for enhancing thermal performance are listed below:
Improving the power dissipation capability of the PCB design
Improving the thermal coupling of the component to the PCB
Introducing airflow in the system
Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where
high maximum power dissipation exists, special care must be paid to thermal dissipation issues in board design.
The maximum junction temperature (T
J
) of the TPS6105x is 150
°
C.
The maximum power dissipation gets especially critical when the device operates in the linear down mode at
high LED current. For single pulse power thermal analysis (e.g., flash strobe), the allowable power dissipation
for the device is given by
Figure 48
.
Figure 48. Single Pulse Power Capability (CSP Package)
32
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TPS61050YZGR 功能描述:LED照明驅(qū)動器 1.2A High Pwr White RoHS:否 制造商:STMicroelectronics 輸入電壓:11.5 V to 23 V 工作頻率: 最大電源電流:1.7 mA 輸出電流: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SO-16N
TPS61050YZGT 功能描述:LED照明驅(qū)動器 1.2A High Pwr White RoHS:否 制造商:STMicroelectronics 輸入電壓:11.5 V to 23 V 工作頻率: 最大電源電流:1.7 mA 輸出電流: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SO-16N
TPS61052 制造商:TI 制造商全稱:Texas Instruments 功能描述:1.2-A HIGH POWER WHITE LED DRIVER 2-MHz SYNCHRONOUS BOOST CONVERTER WITH I2C COMPATIBLE INTERFACE
TPS61052DRC 制造商:TI 制造商全稱:Texas Instruments 功能描述:1.2-A HIGH POWER WHITE LED DRIVER 2-MHz SYNCHRONOUS BOOST CONVERTER WITH I2C COMPATIBLE INTERFACE
TPS61052DRCR 功能描述:LED照明驅(qū)動器 Synch Boost Conv. w/ I2C for Pwr LEDs RoHS:否 制造商:STMicroelectronics 輸入電壓:11.5 V to 23 V 工作頻率: 最大電源電流:1.7 mA 輸出電流: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SO-16N