參數(shù)資料
型號(hào): TPS61028DRC
廠商: Texas Instruments, Inc.
英文描述: 96% EFFICIENT SYNCHRONOUS BOOST CONVERTER
中文描述: 96%高效同步升壓轉(zhuǎn)換器
文件頁(yè)數(shù): 21/27頁(yè)
文件大?。?/td> 498K
代理商: TPS61028DRC
www.ti.com
THERMAL INFORMATION
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires
special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added
heat sinks and convection surfaces, and the presence of other heat-generating components affect the
power-dissipation limits of a given component.
PD(MAX)
TJ(MAX)
TA
RJA
125
°
C
48.7
°
C W
85
°
C
820 mW
(9)
TPS61020
,
TPS61024
,
TPS61025
TPS61026, TPS61027, TPS61028
TPS61029
SLVS451D–SEPTEMBER 2003–REVISED FEBRUARY 2006
Three basic approaches for enhancing thermal performance are listed below.
Improving the power dissipation capability of the PCB design
Improving the thermal coupling of the component to the PCB
Introducing airflow in the system
The maximum recommended junction temperature (T
J
) of the TPS6102x devices is 125
°
C. The thermal
resistance of the 10-pin QFN 3
×
3 package (DRC) is R
Θ
= 48.7
°
C/W, if the PowerPAD is soldered. Specified
regulator operation is assured to a maximum ambient temperature T
A
of 85
°
C. Therefore, the maximum power
dissipation is about 820 mW. More power can be dissipated if the maximum ambient temperature of the
application is lower.
21
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