參數(shù)資料
型號: TPS54429ERSAT
廠商: TEXAS INSTRUMENTS INC
元件分類: 穩(wěn)壓器
英文描述: 0.01 A SWITCHING REGULATOR, PQCC16
封裝: PLASTIC, QFN-16
文件頁數(shù): 12/26頁
文件大?。?/td> 907K
代理商: TPS54429ERSAT
SLVSAS0 –FEBRUARY 2011
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION(1)
TA
PACKAGE(2) (3)
ORDERABLE PART NUMBER
PIN
TRANSPORT MEDIA
TPS54429EPWP
Tube
PowerPAD
14
(HTSSOP) – PWP
TPS54429EPWPR
Tape and Reel
20°C to 85°C
TPS54429ERSAT
Tape and Reel
Plastic Quad Flat Pack (QFN)
16
TPS54429ERSAR
Tape and Reel
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3) All package options have Cu NIPDAU lead/ball finish.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted) (1)
VALUE
UNIT
MIN
MAX
VIN1, VIN2, EN
0.3
20
VBST
0.3
26
VBST (10 ns transient)
0.3
28
Input voltage
VI
range
VFB, VO, SS, PG
0.3
6.5
SW1, SW2
2
20
V
SW1, SW2 (10 ns transient)
3
22
VREG5
0.3
6.5
Output voltage
VO
range
PGND1, PGND2
0.3
Vdiff
Voltage from GND to POWERPAD
0.2
Human Body Model (HBM)
2
kV
ESD
Electrostatic
rating
discharge
Charged Device Model (CDM)
500
V
TJ
Operating junction temperature
20
150
°
C
Tstg
Storage temperature
55
150
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions
is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
THERMAL INFORMATION
TPS54426
THERMAL METRIC(1)
UNITS
PWP (14) PINS
RSA (16) PINS
θJA
Junction-to-ambient thermal resistance
55.6
37.3
θJCtop
Junction-to-case (top) thermal resistance
51.3
42.5
θJB
Junction-to-board thermal resistance
36.4
14.9
°
C/W
ψJT
Junction-to-top characterization parameter
1.8
0.8
ψJB
Junction-to-board characterization parameter
20.6
14.8
θJCbot
Junction-to-case (bottom) thermal resistance
4.3
4.9
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2
2011, Texas Instruments Incorporated
Product Folder Link(s) :TPS54429E
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