參數(shù)資料
型號: TPS5300DAP
英文描述: Analog IC
中文描述: 模擬IC
文件頁數(shù): 15/16頁
文件大?。?/td> 231K
代理商: TPS5300DAP
TPS5300
IMVP MOBILE POWER SUPPLY CONTROLLER
SLVS334 – DECEMBER 2000
15
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
MECHANICAL DATA
DAP (R-PDSO-G**)
PowerPAD
PLASTIC SMALL-OUTLINE PACKAGE
0,25
0,75
0,50
0,15 NOM
Gage Plane
NOM
6,20
8,40
7,80
Thermal Pad
(see Note D)
38
12,60
11,10
32
Seating Plane
12,40
10,90
4073257/A 07/97
20
0,19
19
A
0,30
38
1
9,80
28
A MAX
PINS **
9,60
A MIN
DIM
1,20 MAX
10,90
11,10
30
38 PINS SHOWN
0,10
0,65
M
0,13
0
°
-8
°
0,15
0,05
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion.
D. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane.
This pad is electrically and thermally connected to the backside of the die and possibly selected leads.
E. Falls within JEDEC MO-153
PowerPAD is a trademark of Texas Instruments.
P
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