參數(shù)資料
型號(hào)： TPS2231MRGP
廠商： Texas Instruments, Inc.
英文描述： ExpressCard TM POWER INTERFACE SWITCH
中文描述： 商標(biāo)的ExpressCard電源接口開(kāi)關(guān)
文件頁(yè)數(shù)： 23/35頁(yè)
文件大?。?/td> 1352K
代理商： TPS2231MRGP
PACKAGE OPTION ADDENDUM
28 – Sep – 2006
Addendum Page 1
PACKAGE INFORMATION
Orderable Device
Status (1)
Pkg
Type
Pkg
Drawing
Pins
Pkg
Qty
Eco Plan (2)
Lead/ Ball
Finish
MSL Peak Temp (3)
TPS2231MRGPR
PRE_PROD
QFN
RGP
20
3000
Green (RoHS &
no Sb/ Br)
Green (RoHS &
no Sb/ Br)
Green (RoHS &
no Sb/ Br)
Green (RoHS &
no Sb/ Br)
Green (RoHS &
no Sb/ Br)
Green (RoHS &
no Sb/ Br)
Green (RoHS &
no Sb/ Br)
Green (RoHS &
no Sb/ Br)
Green (RoHS &
no Sb/ Br)
Green (RoHS &
no Sb/ Br)
Green (RoHS &
no Sb/ Br)
Green (RoHS &
no Sb/ Br)
Green (RoHS &
no Sb/ Br)
Green (RoHS &
no Sb/ Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS2231MRGPT
PRE_PROD
QFN
RGP
20
250
CU NIPDAU
Level-2-260C-1 YEAR
TPS2231PW
ACTIVE
TSSOP
PW
20
70
CU NIPDAU
Level-1-260C-UNLIM
TPS2231PWG4
ACTIVE
TSSOP
PW
20
70
CU NIPDAU
Level-1-260C-UNLIM
TPS2231PWP
ACTIVE
HTSSOP
PWP
24
60
CU NIPDAU
Level-2-260C-1 YEAR
TPS2231PWPG4
ACTIVE
HTSSOP
PWP
24
60
CU NIPDAU
Level-2-260C-1 YEAR
TPS2231PWPR
ACTIVE
HTSSOP
PWP
24
2000
CU NIPDAU
Level-2-260C-1 YEAR
TPS2231PWPRG4
ACTIVE
HTSSOP
PWP
24
2000
CU NIPDAU
Level-2-260C-1 YEAR
TPS2231PWR
ACTIVE
TSSOP
PW
20
2000
CU NIPDAU
Level-1-260C-UNLIM
TPS2231PWRG4
ACTIVE
TSSOP
PW
20
2000
CU NIPDAU
Level-1-260C-UNLIM
TPS2231RGPR
ACTIVE
QFN
RGP
20
3000
CU NIPDAU
Level-2-260C-1 YEAR
TPS2231RGPRG4
ACTIVE
QFN
RGP
20
3000
CU NIPDAU
Level-2-260C-1 YEAR
TPS2231RGPT
ACTIVE
QFN
RGP
20
250
CU NIPDAU
Level-2-260C-1 YEAR
TPS2231RGPTG4
ACTIVE
QFN
RGP
20
250
CU NIPDAU
Level-2-260C-1 YEAR
(1) The marketing status values are defined as follows:
ACTIVE
: Product device recommended for new designs.
LIFEBUY
: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND
: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a
new design.
PREVIEW
: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE
: TI has discontinued the production of the device.
(2) Eco Plan -The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) -please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD
: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS)
: TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for
all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at
high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt)
: This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and lead frame. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br)
: TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. --The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications and peak solder
temperature.
Important Information and Disclaimer
: The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy
of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps
to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials
and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not
be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TPS2231MRGPR 功能描述:熱插拔功率分布 ExpressCard Sgl Pwr Interface Sw RoHS:否 制造商:Texas Instruments 產(chǎn)品:Controllers & Switches 電流限制: 電源電壓-最大:7 V 電源電壓-最小:- 0.3 V 工作溫度范圍: 功率耗散: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Tube
TPS2231MRGPR-1 功能描述:熱插拔功率分布 ExpressCard Sgl Pwr Interface Sw RoHS:否 制造商:Texas Instruments 產(chǎn)品:Controllers & Switches 電流限制: 電源電壓-最大:7 V 電源電壓-最小:- 0.3 V 工作溫度范圍: 功率耗散: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Tube
TPS2231MRGPR-1G4 功能描述:熱插拔功率分布 ExpressCard Sgl Pwr Interface Sw RoHS:否 制造商:Texas Instruments 產(chǎn)品:Controllers & Switches 電流限制: 電源電壓-最大:7 V 電源電壓-最小:- 0.3 V 工作溫度范圍: 功率耗散: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Tube
TPS2231MRGPR-2 功能描述:熱插拔功率分布 ExpressCard Sgl Pwr Interface Sw RoHS:否 制造商:Texas Instruments 產(chǎn)品:Controllers & Switches 電流限制: 電源電壓-最大:7 V 電源電壓-最小:- 0.3 V 工作溫度范圍: 功率耗散: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Tube
TPS2231MRGPR-2G4 功能描述:熱插拔功率分布 ExpressCard Sgl Pwr Interface Sw RoHS:否 制造商:Texas Instruments 產(chǎn)品:Controllers & Switches 電流限制: 電源電壓-最大:7 V 電源電壓-最小:- 0.3 V 工作溫度范圍: 功率耗散: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Tube
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