參數(shù)資料
型號: TPS2231MRGP
廠商: Texas Instruments, Inc.
英文描述: ExpressCard TM POWER INTERFACE SWITCH
中文描述: 商標的ExpressCard電源接口開關(guān)
文件頁數(shù): 2/35頁
文件大?。?/td> 1352K
代理商: TPS2231MRGP
www.ti.com
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1)
DISSIPATION RATINGS (Thermal Resistance = °C/W)
TPS2231
TPS2236
SLVS536E–JULY 2004–REVISED SEPTEMBER 2006
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
AVAILABLE OPTIONS
PACKAGED DEVICES
(1)
PowerPAD HTSSOP
T
A
NUMBER OF CHANNELS
TSSOP
QFN
TPS2231RGP
TPS2231MRGP
(2)
Single
TPS2231PW
TPS2231PWP
–40°C to 85°C
Dual
TPS2236DAP
(1)
(2)
The package is available taped and reeled. Add an R suffix to device types (e.g., TPS2231PWPR).
The TPS2231MRGP is identical to the TPS2231RGP with the exception of the PowerPAD dimensions. See the Thermal Pad
Mechanical data portion of this data sheet for specific information.
TPS223x
–0.3 to 6
–0.3 to 6
–0.3 to 6
–0.3 to 6
–0.3 to 6
–0.3 to 6
–0.3 to 6
UNIT
V
V
V
V
V
V
V
V
I(3.3VIN)
V
I(1.5VIN)
V
I(AUXIN)
Input voltage range for card
power
V
I
Logic input/output voltage
V
O(3.3VOUT)
V
O(1.5VOUT)
V
O(AUXOUT)
V
O
Output voltage range
Continuous total power dissipation
See Dissipation Rating Table
Internally limited
Internally limited
Internally limited
10
10
–40 to 120
–55 to 150
260
I
O(3.3VOUT)
I
O(AUXOUT)
I
O(1.5VOUT)
I
O
Output current
OC sink current
PERST sink/source current
Operating virtual junction temperature range
Storage temperature range
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
mA
mA
°C
°C
°C
T
J
T
stg
TPS2231
2
kV
Human body model
(HBM) MIL-STD-883C
TPS2236, all pins except
PERSTx and OCx
TPS2236, PERSTx and OCx
Electrostatic discharge
protection
ESD
1.5
500
kV
V
Charge device model (CDM)
(1)
Stresses beyond those listed under
absolute maximum ratings
may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under
recommended operating
conditions
is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
T
25°C
POWER RATING
704.2 mW
3153 mW
DERATING FACTOR
ABOVE T
A
= 25°C
7.41 mW/°C
33.19 mW/°C
T
= 70°C
POWER RATING
370.6 mW
1659.5 mW
T
= 85°C
POWER RATING
259.5 mW
1161.6 mW
PACKAGE
PW (20)
(1)
PWP (24)
(1)
(1)
These devices are mounted on an JEDEC low-k board (2-oz. traces on surface), (The table is assuming that the maximum junction
temperature is 120°C). The power pad on the device must be soldered down to the power pad on the board if best thermal performance
is needed.
2
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