參數(shù)資料
型號: TPA6140A2YFFT
廠商: Texas Instruments
文件頁數(shù): 23/30頁
文件大?。?/td> 0K
描述: IC AMP AUDIO 25MW STER 16DSBGA
視頻文件: TPA6140A2 Demonstration
特色產(chǎn)品: TPA6140A2 Class G DirectPath? Stereo Headphone Amplifier
標準包裝: 1
系列: DirectPath™
類型: G 類
輸出類型: 耳機,2-通道(立體聲)
在某負載時最大輸出功率 x 通道數(shù)量: 32mW x 2 @ 32 歐姆
電源電壓: 2.5 V ~ 5.5 V
特點: 消除爆音,差分輸入,I²C,靜音,短路和熱保護,關(guān)機,音量控制
安裝類型: 表面貼裝
供應(yīng)商設(shè)備封裝: 16-DSBGA(1.56x1.56)
封裝/外殼: 16-UFBGA,DSBGA
包裝: 標準包裝
產(chǎn)品目錄頁面: 878 (CN2011-ZH PDF)
配用: 296-24299-ND - EVALUATION MODULE FOR TPA6140A2
其它名稱: 296-24303-6
D1
D2
D3
D4
C1
C2
C3
C4
B1
B2
B3
B4
A1
A3
A4
SW
AGND
CPN
SDA
AVDD
CPP
HPVSS
SCL
OUTL
HPVDD
OUTR
INL-
INL+
INR+
A2
SGND
INR-
WCSP PACKAGE
(TOPVIEW)
www.ti.com................................................................................................................................................. SLOS598A – MARCH 2009 – REVISED OCTOBER 2009
DEVICE PINOUT
TERMINAL FUNCTIONS
TERMINAL
INPUT /
OUTPUT /
BALL
DESCRIPTION
POWER
NAME
WCSP
(I/O/P)
INL–
A4
I
Inverting left input for differential signals; connect to left input signal through 1
μF capacitor for
single-ended input applications
INL+
B4
I
Non-inverting left input for differential signals; connect to ground through 1
μF capacitor for
single-ended input applications
INR–
D4
I
Inverting right input for differential signals; connect to right input signal through 1
μF capacitor for
single-ended input applications
INR+
C4
I
Non-inverting right input for differential signals; connect to ground through 1
μF capacitor for
single-ended input applications
SGND
C3
I
Sense Ground; connect to shield terminal of headphone jack or to AGND
SDA
D1
I/O
I2C Data; 1.8 V logic compliant
SCL
D2
I
I2C Clock; 1.8 V logic compliant
OUTL
A3
O
Left headphone amplifier output; connect to left terminal of headphone jack
OUTR
D3
O
Right headphone amplifier output; connect to right terminal of headphone jack
CPP
B2
P
Charge pump positive flying cap; connect to positive side of capacitor between CPP and CPN
CPN
C1
P
Charge pump negative flying cap; connect to negative side of capacitor between CPP and CPN
SW
A1
P
Buck converter switching node
AVDD
A2
P
Primary power supply for device
HPVDD
B3
P
Power supply for headphone amplifier (DC/DC output node)
AGND
B1
P
Main Ground for headphone amplifiers, DC/DC converter, and charge pump
HPVSS
C2
P
Charge pump output; connect 2.2
μF capacitor to GND
ORDERING INFORMATION
TA
PACKAGED DEVICES (1)
PART NUMBER (2)
SYMBOL
16-ball, 1,6 mm × 1,6 mm WCSP
TPA6140A2YFFR
AIFI
–40°C to 85°C
16-ball, 1,6 mm × 1,6 mm WCSP
TPA6140A2YFFT
AIFI
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
(2)
YFF packages are only available taped and reeled. The suffix “R” indicates a reel of 3000, the suffix “T” indicates a reel of 250.
Copyright 2009, Texas Instruments Incorporated
3
Product Folder Link(s): TPA6140A2
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