SLOS557 – SEPTEMBER 2008
參數(shù)資料
型號(hào)： TPA3100D2IRGZRQ1
廠(chǎng)商： Texas Instruments
文件頁(yè)數(shù)： 19/38頁(yè)
文件大?。?/td> 0K
描述： IC AMP AUDIO PWR 21.8W D 48QFN
標(biāo)準(zhǔn)包裝： 1
類(lèi)型： D 類(lèi)
輸出類(lèi)型： 2 通道（立體聲）
在某負(fù)載時(shí)最大輸出功率 x 通道數(shù)量： 21.8W x 2 @ 8 歐姆
電源電壓： 10 V ~ 26 V
特點(diǎn)： 差分輸入，靜音，短路和熱保護(hù)，關(guān)機(jī)
安裝類(lèi)型： 表面貼裝
供應(yīng)商設(shè)備封裝： 48-VQFN 裸露焊盤(pán)（7x7）
封裝/外殼： 48-VFQFN 裸露焊盤(pán)
包裝： 標(biāo)準(zhǔn)包裝
配用： 296-21138-ND - EVALUATION MODULE FOR TPA3100D2
其它名稱(chēng)： 296-24154-6
Thermal Protection
Printed Circuit Board (PCB) Layout
Basic Measurement System
TPA3100D2-Q1
SLOS557 – SEPTEMBER 2008 ......................................................................................................................................................................................... www.ti.com
short-circuit has been detected. When directly connected to MUTE, the MUTE terminal transitions high, and
clears the internal fault flag. This causes the FAULT terminal to cycle low, and normal device operation resumes
if the short-circuit is removed from the output. If a short remains at the output, the cycle continues until the short
is removed. If external MUTE control and automatic recovery from a short-circuit event are desired, an OR gate
can be used to combine the functionality of the FAULT output and external MUTE control (see Figure 32).
Thermal protection on the TPA3100D2 prevents damage to the device when the internal die temperature
exceeds 150°C. There is a ±15°C tolerance on this trip point from device to device. Once the die temperature
exceeds the thermal set point, the device enters into the shutdown state and the outputs are disabled. This is not
a latched fault. The thermal fault is cleared once the temperature of the die is reduced by 30°C. The device
begins normal operation at this point with no external system interaction.
Because the TPA3100D2 is a class-D amplifier that switches at a high frequency, the layout of the PCB should
be optimized according to the following guidelines for the best possible performance.
Decoupling capacitors—The high-frequency 1-F decoupling capacitors should be placed as close to the
PVCC (pins 26, 27, 34, and 35) and AVCC (pin 48) terminals as possible. The VBYP (pin 16) capacitor,
VREG (pin 15) capacitor, and VCLAMP (pins 30 and 31) capacitor should also be placed as close to the
device as possible. Large (220-F or greater) bulk power-supply decoupling capacitors should be placed near
the TPA3100D2 on the PVCCL, PVCCR, and AVCC terminals.
Grounding—The AVCC (pin 48) decoupling capacitor, VREG (pin 15) capacitor, VBYP (pin 16) capacitor, and
ROSC (pin 14) resistor should each be grounded to analog ground (AGND, pin 17). The PVCC decoupling
capacitors and VCLAMP capacitors should each be grounded to power ground (PGND, pins 28, 29, 32, and
33). Analog ground and power ground should be connected at the thermal pad, which should be used as a
central ground connection or star ground for the TPA3100D2.
Output filter—The ferrite EMI filter (Figure 27) should be placed as close to the output terminals as possible
for the best EMI performance. The LC filter (Figure 25 and Figure 26) should be placed close to the outputs.
The capacitors used in both the ferrite and LC filters should be grounded to power ground. If both filters are
used, the LC filter should be placed first, following the outputs.
Thermal Pad—The thermal pad must be soldered to the PCB for proper thermal performance and optimal
reliability. The dimensions of the thermal pad and thermal land should be 5,1 mm by 5,1 mm. Five rows of
solid vias (five vias per row, 0,3302 mm or 13 mils diameter) should be equally spaced underneath the
thermal land. The vias should connect to a solid copper plane, either on an internal layer or on the bottom
layer of the PCB. The vias must be solid vias, not thermal relief or webbed vias. See TI Technical Briefs
SCBA017 and SLUA271 for more information about using the QFN thermal pad. See TI Technical Briefs
SLMA002 for more information about using the thermal pad. For recommended PCB footprints, see the
mechanical information at the end of this data sheet.
For an example layout, see the TPA3100D2 Evaluation Module (TPA3100D2EVM) User Manual (SLOU179).
Both the EVM user manual and the thermal pad application report are available on the TI Web site at
http://www.ti.com.
This application report focuses on methods that use the following equipment:
Audio analyzer or spectrum analyzer
Digital multimeter (DMM)
Oscilloscope
Twisted-pair wires
Signal generator
Power resistor(s)
Linear regulated power supply
Filter components
EVM or other complete audio circuit
26
Copyright 2008, Texas Instruments Incorporated
相關(guān)PDF資料
PDF描述
TPA3123D2PWPR IC AMP AUDIO PWR 25W D 24TSSOP
TPA3130D2DAPR IC AMP AUD PWR 15W STER 32HTSSOP
TPA6140A2YFFR IC AMP AUDIO 25MW STER 16DSBGA
TRF3750IRGPG4 IC PLL FREQ SYNTHESIZER 20-QFN
TRS202IDWR IC DVR/RCVR RS232 ESD DL 16SOIC
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TPA3100D2PHP 功能描述:音頻放大器 20 W Stereo Class-D Audio Amp RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類(lèi)型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
TPA3100D2PHPG4 功能描述:音頻放大器 20 W Stereo Class-D Audio Amp RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類(lèi)型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
TPA3100D2PHPR 功能描述:音頻放大器 20 W Stereo Class-D Audio Amp RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類(lèi)型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
TPA3100D2PHPRG4 功能描述:音頻放大器 20 W Stereo Class-D Audio Amp RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類(lèi)型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
TPA3100D2-Q1 制造商:TI 制造商全稱(chēng):Texas Instruments 功能描述:20-W STEREO CLASS-D AUDIO POWER AMPLIFIER
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫(xiě)一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠(chǎng)商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*