參數(shù)資料
型號(hào)： TPA2100P1YZHR
廠商： TEXAS INSTRUMENTS INC
元件分類： 音頻／視頻放大
英文描述： 1 CHANNEL, AUDIO AMPLIFIER, PBGA16
封裝： 2.10 X 2.10 MM, GREEN, WCSP-16
文件頁(yè)數(shù)： 7/23頁(yè)
文件大?。?/td> 963K
代理商： TPA2100P1YZHR
I
C
1
C =
(2
R
)
f
p
(15)
BOARD LAYOUT
Copper
TraceWidth
Solder
PadWidth
SolderMask
Opening
CopperTrace
Thickness
SolderMask
Thickness
www.ti.com ........................................................................................................................................................................................... SLOS595 – DECEMBER 2008
In making the pad size for the WCSP balls, it is recommended that the layout use nonsolder mask defined
(NSMD) land. With this method, the solder mask opening is made larger than the desired land area, and the
opening size is defined by the copper pad width. Figure 18 and Table 2 shows the appropriate diameters for a
WCSP layout.
Figure 18. Land Pattern Dimensions
Table 2. Land Pattern Dimensions(1) (2) (3) (4)
SOLDER PAD
SOLDER MASK(5)
COPPER
STENCIL(6) (7)
STENCIL
COPPER PAD
DEFINITIONS
OPENING
THICKNESS
OPENING
THICKNESS
Nonsolder mask
275
m × 275 m Sq.
275
m (+0.0, –25 m) 375 m (+0.0, –25 m)
1 oz max (32
m)
125
m thick
defined (NSMD)
(rounded corners)
(1)
Circuit traces from NSMD defined PWB lands should be 75
m to 100 m wide in the exposed area inside the solder mask opening.
Wider trace widths reduce device stand off and impact reliability.
(2)
Best reliability results are achieved when the PWB laminate glass transition temperature is above the operating the range of the
intended application
(3)
Recommend solder paste is Type 3 or Type 4.
(4)
For a PWB using a Ni/Au surface finish, the gold thickness should be less 0,5 mm to avoid a reduction in thermal fatigue performance.
(5)
Solder mask thickness should be less than 20
m on top of the copper circuit pattern
(6)
Best solder stencil performance is achieved using laser cut stencils with electro polishing. Use of chemically etched stencils results in
inferior solder paste volume control.
(7)
Trace routing away from WCSP device should be balanced in X and Y directions to avoid unintentional component movement due to
solder wetting forces.
Copyright 2008, Texas Instruments Incorporated
15
Product Folder Link(s): TPA2100P1
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TPA2100P1YZHT 功能描述:音頻放大器 19Vpp Mono Class D Audio Amplifier RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
TPA2100P1YZHT 制造商:Texas Instruments 功能描述:Audio Power Amplifier IC
TPA21CCGPC0 制造商:TE Connectivity 功能描述:Switch Push Button N.O. DPST Round Plunger 20VAC 20VDC 0.4VA Momentary Contact PC Pins Thru-Hole Loose Piece
TPA21CCGRA0 功能描述:按鈕開(kāi)關(guān) SWITCH PB 2XSPST MOM RND BLK RoHS:否 制造商:C&K Components 觸點(diǎn)形式:2 NC - 2 NO 開(kāi)關(guān)功能:ON ? OFF 電流額定值:4 A 電壓額定值 AC:12 V to 250 V 電壓額定值 DC:12 V to 50 V 功率額定值: 安裝風(fēng)格:Through Hole 照明:Illuminated 照明顏色:None IP 等級(jí):IP 40 端接類型:Solder 觸點(diǎn)電鍍:Silver 執(zhí)行器:Square 蓋顏色: 封裝: 可燃性等級(jí):UL 94 V-0
TPA21CCGRA004 功能描述:按鈕開(kāi)關(guān) FLUSHBUTTON RoHS:否 制造商:C&K Components 觸點(diǎn)形式:2 NC - 2 NO 開(kāi)關(guān)功能:ON ? OFF 電流額定值:4 A 電壓額定值 AC:12 V to 250 V 電壓額定值 DC:12 V to 50 V 功率額定值: 安裝風(fēng)格:Through Hole 照明:Illuminated 照明顏色:None IP 等級(jí):IP 40 端接類型:Solder 觸點(diǎn)電鍍:Silver 執(zhí)行器:Square 蓋顏色: 封裝: 可燃性等級(jí):UL 94 V-0
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