
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : MOS200402
Issued Date : 2004.04.01
Revised Date : 2005.03.10
Page No. : 5/6
H06N60U, H06N60E, H06N60F
HSMC Product Specification
TO-263 Dimension
( ): Reference Dimension, Unit: mm
Min.
-
-
-
-
-
-
-
-
-
-
DIM
A
B
C
D
E
F
G
H
I
J
K
Min.
9.70
1.00
-
9.00
4.70
15.00
-
1.20
1.17
0.70
2.34
Max.
10.10
1.40
(4.60)
9.40
5.10
15.60
(0.40)
1.60
1.37
0.90
2.74
DIM
L
M
N
O
P
Q
R
S
T
U
V
Max.
4.30
1.25
-0.05
2.20
1.90
-
2.24
0.45
9.80
-
-
Max.
4.70
1.40
0.25
2.60
2.10
(0.75)
2.84
0.60
10.20
(7.00)
(4.00)
DIM
W
X
Y
a1
a2
a3
r1
r2
r3
DP
Max.
(7.20)
(0.40)
(0.90)
(15
o
)
(3
o
)
0
o
~3
o
(
φ
1.50)
0.30
(0.45)
(0.20)
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
Head Office
(Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
Factory 1:
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
a3
a1
a2
a2
a2
A
B
D
E
F
H
G
C
I
J
K
K
L
M
N
O
R
P
Q
S
T
U
V
W
D
E
X
Y
F
DP
3-r2
r1
r2
r2
T
2Xr3
2-r2
1
2
3
3-Lead TO-263 Plastic
Surface Mount Package
HSMC Package Code: U
Marking:
Control Code
Date Code
H
0 6
U
Pb Free Mark
Pb-Free: "
.
"
(Note)
Normal: None
N 6 0
Note: Green
label is used for pb-free packing
Pin Style: 1.Gate 2.Drain 3.Source
Material:
Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0