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參數(shù)資料
| 型號(hào)： | TO-220FP |
| 廠商： | 意法半導(dǎo)體 |
| 英文描述： | TRANSISTOR OUTLINE PACKAGE |
| 中文描述： | 晶體管封裝 |
| 文件頁數(shù)： | 4/6頁 |
| 文件大小： | 71K |
| 代理商： | TO-220FP |
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : MOS200402
Issued Date : 2004.04.01
Revised Date : 2005.03.10
Page No. : 4/6
H06N60U, H06N60E, H06N60F
HSMC Product Specification
TO-220AB Dimension
TO-220FP Dimension
A
B
E
G
I
K
M
O
P
3
2
1
C
N
H
D
Tab
F
J
L
Marking:
Control Code
Date Code
H
0 6
E
Pb Free Mark
Pb-Free: "
.
"
(Note)
Normal: None
N 6 0
Note: Green
label is used for pb-free packing
Pin Style: 1.Gate 2 & Tab.Drain 3.Source
Material:
Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
3-Lead TO-220AB
Plastic Package
HSMC Package Code: E
DIM
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
P
Min.
5.58
8.38
4.40
1.15
0.35
2.03
9.66
-
-
3.00
0.75
2.54
1.14
-
12.70
14.48
Max.
7.49
8.90
4.70
1.39
0.60
2.92
10.28
*16.25
*3.83
4.00
0.95
3.42
1.40
*2.54
14.27
15.87
*: Typical, Unit: mm
Marking:
Control Code
Date Code
H
0 6
F
Pb Free Mark
Pb-Free: "
.
"
(Note)
Normal: None
N 6 0
Note: Green
label is used for pb-free packing
Pin Style: 1.Gate 2.Drain 3.Source
Material:
Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
3-Lead TO-220FP
Plastic Package
HSMC Package Code: F
A
D
α
2
F
G
I
K
L
M
3
2
1
C
J
N
α
3
E
O
α
4
α
5
α
1
DIM
A
C
D
E
F
G
I
J
K
L
M
N
O
Min.
6.48
4.40
2.34
0.45
9.80
3.10
2.70
0.60
2.34
12.48
15.67
0.90
2.00
-
-
Max.
7.40
4.90
3.00
0.80
10.36
3.60
3.43
1.00
2.74
13.60
16.20
1.47
2.96
*5
o
*27
o
α
1/2/4/5
α
3
*: Typical, Unit: mm
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