參數(shù)資料
型號(hào)： TNY256P
廠商： POWER INTEGRATIONS INC
元件分類： 穩(wěn)壓器
英文描述： TinySwitch Plus Energy Efficient, Low Power Off-line Switcher
中文描述： SWITCHING CONTROLLER, PDIP8
封裝： 0.300 INCH, PLASTIC, DIP-8
文件頁(yè)數(shù)： 9/20頁(yè)
文件大小： 509K
代理商： TNY256P
C
7/01
TNY256
9
BYPASS Voltage.......................................... -0.3 V to 9 V
Storage Temperature.....................................-65 to 150
°
C
Operating Junction Temperature
(2)
................-40 to 150
°
C
Lead Temperature
(3)
................................................ 260
°
C
3. 1/16" from case for 5 seconds.
ABSOLUTE MAXIMUM RATINGS
(1)
DRAIN Voltage ....................................... - 0.3 V to 700 V
Peak DRAIN Current .............................................800 mA
EN/UV Voltage............................................ - 0.3 V to 9 V
EN/UV Current ......................................................100 mA
1. All voltages referenced to SOURCE, T
A
= 25
°
C.
2. Normally limited by internal circuitry.
S1 Open
See Note A
I
EN/UV
= -25
μ
A
I
EN/UV
= 25
μ
A
V
= 0 V
(MOSFET Not Switching)
See Note B
EN/UV Open
(MOSFET Switching)
See Note B, C
-68
-50
-28
-15
-10
-5
1.10
1.45
1.80
-58
-35
215
CONTROL FUNCTIONS
Output
Frequency
Maximum
Duty Cycle
EN/UV Pin Turnoff
Threshold Current
EN/UV Pin
Hysteresis Current
EN/UV Pin
Voltage
EN/UV Short-
Circuit Current
DRAIN
Supply Current
BYPASS Pin
Charge Current
kHz
%
μ
A
μ
A
V
μ
A
μ
A
μ
A
mA
mA
Min
Typ
Max
f
OSC
DC
MAX
I
DIS
I
HYS
V
EN
I
ENSC
I
S1
I
S2
I
CH1
I
CH2
Parameter
Symbol
(Unless Otherwise Specified)
See Figure 14
Conditions
130
255
-5.50
-4.10
T
= 25
°
C
See Figure 4
Units
SOURCE = 0 V
;
T
= -40 to 125
°
C
66
T
J
= -40
°
C to 125
°
C
T
J
= 125
°
C
-52
V
EN/UV
= 0 V, T
J
= -40
°
C to 125
°
C
V
EN/UV
= 0 V, T
J
= 125
°
C
-45
V
BP
= 0 V, T
J
= 25
°
C
See Note D, E
V
BP
= 4 V, T
J
= 25
°
C
See Note D, E
170
2.70
-40
5.0
Average
Peak-Peak Jitter
115
140
63
69
3.8
6.2
-68
-41
1.85
3.25
-58
-25
300
-3.75
-7.50
-6.00
-2.25
Thermal Impedance: Y Package (
θ
JA
)
(1)
............... 70
°
C/W
(
θ
JC
)
(2)
................. 2
°
C/W
P/G Package:
(
θ
JA
) ........45
°
C/W
(3)
; 35
°
C/W
(4)
(
θ
JC
)
(2)
.......................... 11
°
C/W
1. Free standing with no heatsink.
2. Measured at tab closest to plastic interface or source pin.
3. Soldered to 0.36 sq. inch (232mm
2
), 2oz (610 gm/m
2
) copper
clad.
4. Soldered to 1 sq. inch (645mm
2
), 2oz. (610 gm/m
2
) copper clad
THERMAL IMPEDANCE
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