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參數資料
| 型號： | TMS3473 |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | PARALLEL DRIVER |
| 中文描述： | 并行驅動 |
| 文件頁數： | 4/9頁 |
| 文件大小： | 107K |
| 代理商： | TMS3473 |
TMS3473B
PARALLEL DRIVER
SOCS022B – NOVEMBER 1990
4
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Positive supply voltage, V
CC
(see Note 1)
Negative supply voltage, V
SS
(see Note 2)
Positive ABG supply voltage, V
ABG+
Negative ABG supply voltage, V
ABG–
ABG supply voltage differential (V
ABG+
– V
SS
)
Continuous total power dissipation at (or below), T
A
≤
25
°
C:
4.4 V
–11.1 V
5.6 V
–8 V
15.2 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Unmounted device (see Figure 3)
Mounted device (see Figure 3)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
825 mW
1150 mW
. . . . . . . . . . . . . .
. . . . . . . . . . . . . . . .
Operating free-air temperature range, T
A
Storage temperature range, T
STG
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
–20
°
C to 45
°
C
–55
°
C to 125
°
C
260
°
C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES:
1. All voltage values are with respect to GND.
2. The algebraic convention, in which the least positive (most negative) value is designated minimum, is used in this data sheet for
voltage levels only.
0
10
20
30
40
50
60
70
0
500
1000
900
1500
1400
PD
TA – Free-Air Temperature –
°
C
Mounted Device
(see Note A)
Unmounted Device
POWER DISSIPATION
vs
FREE-AIR TEMPERATURE
100
200
300
400
600
700
800
1100
1200
1300
Figure 3
NOTE A: The mounted-device derating curve in Figure 3 is obtained under the following conditions:
The board is 50 mm by 50 mm by 1.6 mm thick.
The board material is glass epoxy.
The copper thickness of all the etch runs is 35 microns.
Etch run dimensions – DW package – All 20 etch runs are 0.4 mm by 22 mm.
Each chip is soldered to the board.
An aluminum cooling fin 10 mm by 10 mm by 1 mm thick is coupled to the chip with thermal paste.
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