參數(shù)資料
型號： TMS32C6415EGLSA6E3
廠商： Texas Instruments, Inc.
元件分類： 數(shù)字信號處理
英文描述： FIXED-POINT DIGITAL SIGNAL PROCESSORS
中文描述： 定點數(shù)字信號處理器
文件頁數(shù)： 73/141頁
文件大?。?/td> 2234K
代理商： TMS32C6415EGLSA6E3
TMS320C6414, TMS320C6415, TMS320C6416
FIXED-POINT DIGITAL SIGNAL PROCESSORS
SPRS146N
FEBRUARY 2001
REVISED MAY 2005
73
POST OFFICE BOX 1443
HOUSTON, TEXAS 77251
1443
DV
DD
CV
DD
V
SS
C6000
DSP
Schottky
Diode
I/O Supply
Core Supply
GND
Figure 11. Schottky Diode Diagram
Core and I/O supply voltage regulators should be located close to the DSP (or DSP array) to minimize
inductance and resistance in the power delivery path. Additionally, when designing for high-performance
applications utilizing the C6000
platform of DSPs, the PC board should include separate power planes for
core, I/O, and ground, all bypassed with high-quality low-ESL/ESR capacitors.
power-supply decoupling
In order to properly decouple the supply planes from system noise, place as many capacitors (caps) as possible
close to the DSP. Assuming 0603 caps, the user should be able to fit a total of 60 caps, 30 for the core supply
and 30 for the I/O supply. These caps need to be close to the DSP power pins, no more than 1.25 cm maximum
distance to be effective. Physically smaller caps, such as 0402, are better because of their lower parasitic
inductance. Proper capacitance values are also important. Small bypass caps (near 560 pF) should be closest
to the power pins. Medium bypass caps (220 nF or as large as can be obtained in a small package) should be
next closest. TI recommends no less than 8 small and 8 medium caps per supply (32 total) be placed
immediately next to the BGA vias, using the “interior” BGA space and at least the corners of the “exterior”.
Eight larger caps (4 for each supply) can be placed further away for bulk decoupling. Large bulk caps (on the
order of 100
μ
F) should be furthest away (but still as close as possible). No less than 4 large caps per supply
(8 total) should be placed outside of the BGA.
Any cap selection needs to be evaluated from a yield/manufacturing point-of-view. As with the selection of any
component, verification of capacitor availability over the product’s production lifetime should be considered.
相關(guān)PDF資料
PDF描述
TMS32C6414DGLSA6E3 FIXED-POINT DIGITAL SIGNAL PROCESSORS
TMS32C6415DGLSA6E3 FIXED-POINT DIGITAL SIGNAL PROCESSORS
TMS32C6416DGLSA6E3 FIXED-POINT DIGITAL SIGNAL PROCESSORS
TMS32C6414CGLSA6E3 FIXED-POINT DIGITAL SIGNAL PROCESSORS
TMS32C6414CZLZA6E3 FIXED-POINT DIGITAL SIGNAL PROCESSORS
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TMS32C6415EGLZ5E0 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC Fixed-Pt Dig Signal Proc RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風格:SMD/SMT
TMS32C6415EGLZ6E3 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC Fixed-Point DSP TMS320 Platform RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風格:SMD/SMT
TMS32C6415EGLZ6E3C 制造商:Rochester Electronics LLC 功能描述: 制造商:Texas Instruments 功能描述:
TMS32C6415EGLZ7E3 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC Fixed-Pt Dig Sig Proc RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風格:SMD/SMT
TMS32C6415EGLZA5E0 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC Fixed-Point DSP TMS320 Platform RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風格:SMD/SMT
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