參數(shù)資料
型號： TMP32C6411GLZ
廠商： Texas Instruments, Inc.
元件分類： 數(shù)字信號處理
英文描述： FIXED POINT DIGITAL SIGNAL PROCESSOR
中文描述： 定點數(shù)字信號處理器
文件頁數(shù)： 116/119頁
文件大?。?/td> 1742K
代理商： TMP32C6411GLZ
SPRS196H MARCH 2002 REVISED JULY 2004
116
POST OFFICE BOX 1443
HOUSTON, TEXAS 772511443
MECHANICAL DATA
The following table(s) show the thermal resistance characteristics for the PBGA — GLZ and ZLZ mechanical
packages.
thermal resistance characteristics (S-PBGA package) [GLZ]
NO.
°
C/W
1.55
Air Flow (m/s)
1
R
Θ
JC
R
Θ
JB
R
Θ
JA
R
Θ
JA
R
Θ
JA
R
Θ
JA
PsiJT
PsiJB
Junction-to-case
N/A
2
Junction-to-board
9.1
N/A
3
Junction-to-free air
17.9
0.00
4
Junction-to-free air
15.02
0.5
5
Junction-to-free air
13.4
1.0
6
Junction-to-free air
11.89
2.00
7
Junction-to-package top
0.5
N/A
8
Junction-to-board
7.4
N/A
m/s = meters per second
thermal resistance characteristics (S-PBGA package) [ZLZ]
NO.
°
C/W
1.55
Air Flow (m/s)
1
R
Θ
JC
R
Θ
JB
R
Θ
JA
R
Θ
JA
R
Θ
JA
R
Θ
JA
PsiJT
PsiJB
Junction-to-case
N/A
2
Junction-to-board
9.1
N/A
3
Junction-to-free air
17.9
0.00
4
Junction-to-free air
15.02
0.5
5
Junction-to-free air
13.4
1.0
6
Junction-to-free air
11.89
2.00
7
Junction-to-package top
0.5
N/A
8
Junction-to-board
7.4
N/A
m/s = meters per second
The following mechanical package diagram(s) reflect the most up-to-date mechanical data released for these
designated device(s).
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