參數(shù)資料
型號: TMP320F2812GHHS
廠商: Texas Instruments, Inc.
元件分類: 數(shù)字信號處理
英文描述: DIGITAL SIGNAL PROCESSORS
中文描述: 數(shù)字信號處理器
文件頁數(shù): 144/147頁
文件大?。?/td> 2021K
代理商: TMP320F2812GHHS
Mechanical Data
144
June 2004
SPRS257
8
Mechanical Data
8.1
Ball Grid Array (BGA)
GHH (S-PBGA-N179)
PLASTIC BALL GRID ARRAY
0,08
0,10
1,40 MAX
0,85
0,55
0,45
0,45
0,35
0,95
11,90
12,10
SQ
4173504
3/C 12/01
Seating Plane
7
B
A
2
1
C
D
F
E
G
4
3
6
5
N
M
K
J
H
L
P
9
8
11
10
13
12
14
0,40
10,40 TYP
0
A1 Corner
Bottom View
0
0,80
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice
C. MicroStar BGA configuration.
D. This package is not lead-free and needs a minimum reflow temperature of 220
°
C but not exceeding 235
°
C.
Figure 7
1. TMS320R2812 179-Ball GHH MicroStar BGA
Table 7
1. Thermal Resistance Characteristics for 179-GHH
PARAMETER
Psi
JT
Θ
JA
Θ
JC
179-GHH PACKAGE
0.658
UNIT
°
C/W
42.57
°
C/W
16.08
°
C/W
A
MicroStar BGA is a trademark of Texas Instruments.
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