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參數(shù)資料
| 型號(hào)： | TLE8263E |
| 廠商： | Infineon Technologies |
| 文件頁數(shù)： | 13/16頁 |
| 文件大小： | 0K |
| 描述： | IC SYSTEM BASIS CHIP DSO-36 |
| 標(biāo)準(zhǔn)包裝： | 1,000 |
| 類型： | 收發(fā)器 |
| 應(yīng)用： | 自動(dòng) |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 36-BSSOP（0.295"，7.50mm 寬）裸露焊盤 |
| 供應(yīng)商設(shè)備封裝： | PG-DSO-36 |
| 包裝： | 帶卷 (TR) |
| 其它名稱： | SP000317795 TLE8263EFUMA1 TLE8263EXUMA1 |
ESD Robustness of TLE6251DS in comparison with the competition
ESD robustness: holding the leadership in performance and innovation
O NE OF T h E S PE CIFIC C h ALLENGE S for a transceiver device is to withstand the harsh signals that occur on
the bus, from ESD (Electro Static Discharges) to voltage peaks resulting from the parasitic inductances of bus cables. A robust
transceiver also does not need expensive external protection components such a zener diodes or varistors.
O VE r T h E P AS T y EA r S Infineon developed and improved an innovative integrated protection that enables the
dissipation of the energy, which is converted during an ESD event, through the chip from top to bottom. Silicon On Isolator (SOI)
type technologies where the active side of the chip is decoupled from its bottom by an insulator do not allow such concepts.
Infineons products can hold more than 10 kVolts of discharges using ISO 61000-4-2 test standard, an application oriented testing
method that applies an energy which is five times higher than the standard hBM (human Body Model) test that simulates typical
handling events.
6
Competition
Infineon TLE7259-2G
M
ax
imum
ESD
di
sc
har
ge
re
si
st
anc
e
at
bu
s
pin
s
(kV)
ISO 61000-4-2 150 pF / 330 T
(without bus filter)
ISO 61000-4-2 150 pF / 330 T
(with bus filter C = 3.3 nF)
+1 kV
+15 kV
+1 kV
+15 kV
Competition
Infineon TLE6251DS
M
ax
imum
ESD
di
sc
har
ge
re
si
st
anc
e
at
bu
s
pin
s
(kV)
ISO 61000-4-2 150 pF / 330 T
ISO 61000-4-2 150 pF / 2 kT
+2 kV
+10 kV
+1,5 kV
+13 kV
ESD Robustness of TLE7259-2G in comparison with the competition
08-01-16 RZ Transceiver Gesamt.indd 6
16.01.2008 12:23:30 Uhr
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TLE8263EFUMA1 | 制造商:Infineon Technologies AG 功能描述:System Basis Chip 36-Pin DSO EP T/R |
| TLE8263EXUMA1 | 功能描述:CAN 接口集成電路 BODY SYSTEM ICS RoHS:否 制造商:Texas Instruments 類型:Transceivers 工作電源電壓:5 V 電源電流: 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:SOIC-8 封裝:Tube |
| TLE8263EXUMA2 | 制造商:Infineon Technologies AG 功能描述:BODY SYSTEM ICS - Tape and Reel 制造商:Infineon Technologies AG 功能描述:Universal System Basis Chip |
| TLE8264-2E | 功能描述:處理器 - 專門應(yīng)用 BODY SYSTEM ICS RoHS:否 制造商:Freescale Semiconductor 類型:Multimedia Applications 核心:ARM Cortex A9 處理器系列:i.MX6 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:1 GHz 指令/數(shù)據(jù)緩存: 數(shù)據(jù) RAM 大小:128 KB 數(shù)據(jù) ROM 大小: 工作電源電壓: 最大工作溫度:+ 95 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MAPBGA-432 |
| TLE82642EXUMA1 | 制造商:Infineon Technologies AG 功能描述:Enhanced Power Package T/R 制造商:Infineon Technologies AG 功能描述:BODY SYSTEM ICS - Tape and Reel 制造商:Infineon Technologies AG 功能描述:IC SYSTEM BASIS CHIP DSO-36 |
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