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參數(shù)資料
| 型號(hào)： | TL1591CPS |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | 192- 】 165-pixel ccd image sensor |
| 中文描述： | 192 - 】165萬像素CCD圖像傳感器 |
| 文件頁數(shù)： | 1/13頁 |
| 文件大?。?/td> | 173K |
| 代理商： | TL1591CPS |
TC211
192-
×
165-PIXEL CCD IMAGE SENSOR
SOCS008B – JANUARY 1990
Copyright
1990, Texas Instruments Incorporated
2-1
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
Full-Frame Operation
Antiblooming Capability
Single-Phase Clocking for Horizontal and
Vertical Transfers
Fast Clear Capability
Dynamic Range . . . 60 dB Typical
High Blue Response
High Photoresponse Uniformity
Solid-State Reliability With No Image
Burn-In, Residual Imaging, Image
Distortion, Image Lag, or Microphonics
6-Pin Dual-In-Line Ceramic Package
Square Image Area:
– 2640
μ
m by 2640
μ
m
– 192 Pixels (H) by 165 Pixels (V)
– Each Pixel 13.75
μ
m (H) by 16
μ
m (V)
description
The TC211 is a full-frame charge-coupled device (CCD) image sensor designed specifically for industrial
applications requiring ruggedness and small size. The image-sensing area is configured into 165 horizontal
lines each containing 192 pixels. Twelve additional pixels are provided at the end of each line to establish a dark
reference and line clamp. The antiblooming feature is activated by supplying clock pulses to the antiblooming
gate, an integral part of each image-sensing element. The charge is converted to signal voltage at 4
μ
V per
electron by a high-performance structure with built-in automatic reset and a voltage-reference generator. The
signal is further buffered by a low-noise two-stage source-follower amplifier to provide high output-drive
capability.
The TC211 is supplied in a 6-pin dual-in-line ceramic package approximately 7,5 mm (0.3 in.) square. The glass
window can be cleaned using any standard method for cleaning optical assemblies or by wiping the surface with
a cotton swab soaked in alcohol.
The TC211 is characterized for operation from –10
°
C to 45
°
C.
This MOS device contains limited built-in gate protection. During storage or handling, the device leads should be shorted together
or the device should be placed in conductive foam. In a circuit, unused inputs should always be connected to VSS. Under no
circumstances should pin voltages exceed absolute maximum ratings. Avoid shorting OUT to VSS during operation to prevent
damage to the amplifier. The device can also be damaged if the output terminals are reverse-biased and an excessive current is
allowed to flow. Specific guidelines for handling devices of this type are contained in the publication Guidelines for Handling
Electrostatic-Discharge-Sensitive (ESDS) Devices and Assembliesavailable from Texas Instruments.
ADB
VSS
ABG
OUT
SRG
IAG
4
5
6
3
2
1
DUAL-IN-LINE PACKAGE
(TOP VIEW)
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
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