參數(shù)資料
型號(hào): TL052MFK
廠商: Texas Instruments, Inc.
英文描述: ENHANCED-JFET LOW-OFFSET OPERATIONAL AMPLIFIERS
中文描述: 增強(qiáng)型場效應(yīng)低失調(diào)運(yùn)算放大器
文件頁數(shù): 5/65頁
文件大?。?/td> 1022K
代理商: TL052MFK
TL05x, TL05xA, TL05xY
ENHANCED-JFET LOW-OFFSET
OPERATIONAL AMPLIFIERS
SLOS178 – FEBRUARY 1997
5
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
TL052Y chip information
This chip, when properly assembled, displays characteristics similar to the TL052. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 MILS TYPICAL
BONDING PADS: 4
×
4 MILS MINIMUM
TJmax = 150
°
C
TOLERANCES ARE
±
10%.
ALL DIMENSIONS ARE IN MILS.
PIN (4) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
+
1OUT
1IN+
1IN–
VCC+
(8)
(6)
(3)
(2)
(5)
(1)
+
(7)
2IN+
2IN–
2OUT
(4)
VCC–
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
66
72
相關(guān)PDF資料
PDF描述
TL054AMD ENHANCED-JFET LOW-OFFSET OPERATIONAL AMPLIFIERS
TL054AMJ ENHANCED-JFET LOW-OFFSET OPERATIONAL AMPLIFIERS
TL054AMN ENHANCED-JFET LOW-OFFSET OPERATIONAL AMPLIFIERS
TL051AMD ENHANCED-JFET LOW-OFFSET OPERATIONAL AMPLIFIERS
TL052MP ENHANCED-JFET LOW-OFFSET OPERATIONAL AMPLIFIERS
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TL052MFKB 制造商:Rochester Electronics LLC 功能描述:- Bulk
TL052MJG 制造商:TI 制造商全稱:Texas Instruments 功能描述:ENHANCED-JFET LOW-OFFSET OPERATIONAL AMPLIFIERS
TL052MJGB 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:ENHANCED-JFET LOW-OFFSET OPERATIONAL AMPLIFIERS
TL052MLB 制造商:Rochester Electronics LLC 功能描述:- Bulk
TL052MP 制造商:TI 制造商全稱:Texas Instruments 功能描述:ENHANCED-JFET LOW-OFFSET OPERATIONAL AMPLIFIERS