- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄384975 > THS4601CDDA (Texas Instruments, Inc.) WIDEBAND, FET-INPUT OPERATIONAL AMPLIFIER PDF資料下載
參數(shù)資料
| 型號(hào)： | THS4601CDDA |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | WIDEBAND, FET-INPUT OPERATIONAL AMPLIFIER |
| 中文描述： | 寬帶，場(chǎng)效應(yīng)管輸入運(yùn)算放大器 |
| 文件頁數(shù)： | 21/27頁 |
| 文件大?。?/td> | 381K |
| 代理商： | THS4601CDDA |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁當(dāng)前第21頁第22頁第23頁第24頁第25頁第26頁第27頁
THS4601
SLOS388B
–
OCTOBER 2001
–
REVISED JUNE 2002
21
www.ti.com
APPLICATION INFORMATION
power dissipation and thermal characteristics
The THS4601 does not incorporate automatic thermal shutoff protection, so the designer must take care to
ensure that the design does not violate the absolute maximum junction temperature of the device. Failure may
result if the absolute maximum junction temperature of 150
°
C is exceeded.
The thermal characteristics of the device are dictated by the package and the PC board. Maximum power
dissipation for a given package can be calculated using the following formula.
P
Dmax
Tmax
–
TA
JA
Where:
P
Dmax
is the maximum power dissipation (W)
T
max
is the absolute maximum junction temperature (
°
C)
T
A
is the ambient temperature (
°
C)
θ
JA
is the thermal coefficient from the silicon junctions to the ambient air (
°
C/W)
For systems where heat dissipation is more critical, the THS4601 is offered in an 8-pin SOIC with PowerPAD.
The thermal coefficient for the SOIC PowerPAD is substantially improved over the traditional SOIC. Maximum
power dissipation levels are depicted in the graph for the two packages. The data for the 8DDA package
assumes a board layout that follows the PowerPAD layout guidelines.
0
–
40
0.5
1
1.5
2
2.5
3
–
20
0
20
40
60
80
8DDA Package
8D Package
θ
JA = 170
°
C/W for 8D,
θ
JA = 66.6
°
C/W for 8DDA
Ambient Temperature
–
°
C
Figure 40
M
–
MAXIMUM POWER DISSIPATION
vs
TEMPERATURE
When determining whether or not the device satisfies the maximum power dissipation requirement, it is
important to not only consider quiescent power dissipation, but also dynamic power dissipation. Often times,
this is difficult to quantify because the signal pattern is inconsistent, but an estimate of the RMS power
dissipation can provide visibility into a possible problem.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| THS5641ADW | 8-BIT, 100 MSPS, CommsDACE DIGITAL-TO-ANALOG CONVERTER |
| THS5641APW | 8-BIT, 100 MSPS, CommsDACE DIGITAL-TO-ANALOG CONVERTER |
| THS5641DW | 8-BIT, 100 MSPS, CommsDACE DIGITAL-TO-ANALOG CONVERTER |
| THS5641PW | 8-BIT, 100 MSPS, CommsDACE DIGITAL-TO-ANALOG CONVERTER |
| THS6007 | Dual Differential Line Drivers and Low-Power Receivers |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| THS4601CDDAG3 | 功能描述:高速運(yùn)算放大器 Wideband FET-Input Op Amp RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補(bǔ)償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
| THS4601CDDAR | 功能描述:高速運(yùn)算放大器 Wideband FET-Input Op Amp RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補(bǔ)償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
| THS4601CDDARG3 | 功能描述:高速運(yùn)算放大器 Wideband FET-Input Op Amp RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補(bǔ)償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
| THS4601CDG4 | 功能描述:高速運(yùn)算放大器 Wideband FET-Input Op Amp RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補(bǔ)償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
| THS4601EVM | 功能描述:放大器 IC 開發(fā)工具 THS4601 Eval Mod RoHS:否 制造商:International Rectifier 產(chǎn)品:Demonstration Boards 類型:Power Amplifiers 工具用于評(píng)估:IR4302 工作電源電壓:13 V to 23 V |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。