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| 型號： | THS4051JG |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | 70-MHz HIGH-SPEED AMPLIFIERS |
| 中文描述： | 70 - MHz的高速放大器 |
| 文件頁數(shù)： | 22/30頁 |
| 文件大小： | 487K |
| 代理商： | THS4051JG |
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THS4051, THS4052
70-MHz HIGH-SPEED AMPLIFIERS
SLOS238C– MAY 1999 – REVISED MAY 2000
22
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
APPLICATION INFORMATION
general PowerPAD
design considerations (continued)
The actual thermal performance achieved with the THS405xDGN in its PowerPAD
package depends on the
application. In the example above, if the size of the internal ground plane is approximately 3 inches
×
3 inches,
then the expected thermal coefficient,
θ
JA
,
is
about 58.4
°
C/W. For comparison, the non-PowerPAD
version
of the THS405x IC (SOIC) is shown. For a given
θ
JA
, the maximum power dissipation is shown in Figure 53 and
is calculated by the following formula:
PD
TMAX–TA
JA
Where:
P
D
T
MAX
= Absolute maximum junction temperature (150
°
C)
T
A
= Free-ambient air temperature (
°
C)
θ
JA
=
θ
JC
+
θ
CA
θ
JC
= Thermal coefficient from junction to case
θ
CA
= Thermal coefficient from case to ambient air (
°
C/W)
= Maximum power dissipation of THS405x IC (watts)
DGN Package
θ
JA = 58.4
°
C/W
2 oz. Trace And Copper Pad
With Solder
DGN Package
θ
JA = 158
°
C/W
2 oz. Trace And
Copper Pad
Without Solder
SOIC Package
High-K Test PCB
θ
JA = 98
°
C/W
TJ = 150
°
C
SOIC Package
Low-K Test PCB
θ
JA = 167
°
C/W
2
1.5
1
0
–40
–20
0
20
40
M
2.5
3
MAXIMUM POWER DISSIPATION
vs
FREE-AIR TEMPERATURE
3.5
60
80
100
0.5
TA – Free-Air Temperature –
°
C
NOTE A: Results are with no air flow and PCB size = 3”
×
3”
Figure 53. Maximum Power Dissipation vs Free-Air Temperature
More complete details of the PowerPAD
installation process and thermal management techniques can be
found in the Texas Instruments Technical Brief, PowerPAD
Thermally Enhanced Package.This document can
be found at the TI web site (www.ti.com) by searching on the key word PowerPAD
. The document can also
be ordered through your local TI sales office. Refer to literature number SLMA002 when ordering.
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| THS4052D | 70-MHz HIGH-SPEED AMPLIFIERS |
| THS4052DGN | 70-MHz HIGH-SPEED AMPLIFIERS |
| THS4052EVM | 70-MHz HIGH-SPEED AMPLIFIERS |
| THS4051DGN | 70-MHz HIGH-SPEED AMPLIFIERS |
| THS4051EVM | 70-MHz HIGH-SPEED AMPLIFIERS |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| THS4051MFK | 制造商:TI 制造商全稱:Texas Instruments 功能描述:70-MHz HIGH-SPEED AMPLIFIERS |
| THS4051MFKB | 制造商:Texas Instruments 功能描述:OP Amp Single Volt Fdbk ±16.5V/33V 20-Pin LCCC Tube |
| THS4051MJG | 制造商:Texas Instruments 功能描述:OP Amp Single Volt Fdbk ±16.5V/33V 8-Pin CDIP Tube 制造商:Texas Instruments 功能描述:HIGH SPEED, SINGLE OP AMP |
| THS4051MJGB | 制造商:Texas Instruments 功能描述:OP Amp Single Volt Fdbk ±16.5V/33V 8-Pin CDIP Tube |
| THS4052 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:70-MHz HIGH-SPEED AMPLIFIERS |
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