參數(shù)資料
型號: TFDU5103-TR3
廠商: Vishay Intertechnology,Inc.
英文描述: Fast Infrared Transceiver Module (MIR, 1.152 Mbit/s) for 2.7 V to 5.5 V Operation
中文描述: 快速紅外收發(fā)器模塊(,補(bǔ)償1.152兆位/秒)為2.7 V至5.5 V工作電壓
文件頁數(shù): 10/16頁
文件大小: 420K
代理商: TFDU5103-TR3
www.vishay.com
10
Document Number 82618
Rev. 1.2, 24-Jun-04
VISHAY
TFDU5103
Vishay Semiconductors
Recommended Solder Profile
Solder Profile for Sn/Pb soldering
Lead-Free, Recommended Solder Profile
The TFDU5103 is a lead-free transceiver and quali-
fied for lead-free processing. For lead-free solder
paste like Sn
(3.0 - 4.0)
Ag
(0.5 - 0.9)
Cu, there are two
standard reflow profiles: Ramp-Soak-Spike (RSS)
and Ramp-To-Spike (RTS). The Ramp-Soak-Spike
profile was developed primarily for reflow ovens
heated by infrared radiation. Shown below in figure 4
is Vishay’s recommended profile for use with the
TFDU5103 transceivers. For more details please
Figure 3. Recommended Solder Profile
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