參數(shù)資料
型號: TEMD5120X01
廠商: Vishay Intertechnology,Inc.
英文描述: Silicon PIN Photodiode, RoHS Compliant, Released for Lead (Pb)-free Solder Process, AEC-Q101 Released
中文描述: 硅PIN光電二極管,符合RoHS,為無鉛(Pb發(fā)布)焊接工藝,通過AEC - Q101發(fā)布
文件頁數(shù): 6/8頁
文件大?。?/td> 134K
代理商: TEMD5120X01
www.vishay.com
6
Document Number 84680
Rev. 1.3, 07-May-07
TEMD5120X01
Vishay Semiconductors
Reflow Solder Profiles
Drypack
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a
desiccant.
Floor Life
Floor life (time between soldering and removing from
MBB) must not exceed the time indicated in
J-STD-020. TEMD5110 is released for:
Moisture Sensitivity Level 4, according to
JEDEC, J-STD-020
Floor Life: 72 h
Conditions: T
amb
< 30 °C, RH < 60 %
Drying
In case of moisture absorption devices should be
baked before soldering. Conditions see J-STD-020 or
Label. Devices taped on reel dry using recommended
conditions 192 h at 40 °C (+ 5 °C), RH < 5 % or 96 h
at 60 °C (+ 5 °C), RH < 5 %.
Figure 8. Lead (Pb)-free (Sn) Reflow Solder Profile
Figure 9. Lead Tin (SnPb) Reflow Solder Profile
20
0
T
u
r
20 s
~
30 s
40 s
~
~
120 s
125 °C
145 °C
210 °C
250 °C
260 °C
2
8
0
260
240
220
200
1
8
0
160
140
120
8
0
60
40
100
0
Time (s)
Preheat
Reflow
Coolin
g
19030
300
270
240
210
1
8
0
150
120
90
60
30
max. 160 °C
f
u
ll line: typical
dotted: process limits
Time (s)
T
u
r
Lead Temperature
90 s - 120 s
300
250
200
150
100
50
0
0
max. 240 °C ca. 230 °C
10 s
215 °C
max 40s
2 K/s - 4 K/s
94
8
625
250
200
150
100
50
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