參數(shù)資料
型號: TEF6892H/V2,518
廠商: NXP SEMICONDUCTORS
元件分類: 消費(fèi)家電
英文描述: SPECIALTY CONSUMER CIRCUIT, PQFP44
封裝: 10 X 10 MM, 1.75 MM HEIGHT, PLASTIC, SOT-307-2, QFP-44
文件頁數(shù): 12/59頁
文件大?。?/td> 329K
代理商: TEF6892H/V2,518
2003 Oct 21
2
Philips Semiconductors
Product specication
Car radio integrated signal processor
TEF6892H
CONTENTS
1
FEATURES
1.1
General
1.2
I2C-bus
1.3
Stereo decoder
1.4
Noise blanking
1.5
Weak signal processing
1.6
RDS demodulator and decoder
1.7
Tone/volume part
2
GENERAL DESCRIPTION
3
ORDERING INFORMATION
4
QUICK REFERENCE DATA
5
BLOCK DIAGRAM
6
PINNING
7
FUNCTIONAL DESCRIPTION
7.1
Stereo decoder
7.2
FM and AM noise blanker
7.3
High cut control and de-emphasis
7.4
Noise detector
7.4.1
FM noise detector
7.4.2
AM noise detector
7.5
Multipath/weak signal processing
7.6
Tone/volume control
7.6.1
Input selector
7.6.2
Loudness
7.6.3
Volume/balance
7.6.4
Treble
7.6.5
Bass
7.6.6
Fader/mute
7.6.7
Beep generator and NAV input with output
mixer
7.7
RDS demodulator and decoder
7.7.1
RDS demodulator
7.7.2
RDS decoder
8
LIMITING VALUES
9
THERMAL CHARACTERISTICS
10
CHARACTERISTICS
11
I2C-BUS PROTOCOL
11.1
Read mode
11.1.1
Data byte 1; STATUS
11.1.2
Data byte 2; LEVEL
11.1.3
Data byte 3; USN and WAM
11.1.4
Data byte 4; RDS STATUS
11.1.5
Data byte 5; RDS LDATM
11.1.6
Data byte 6; RDS LDATL
11.1.7
Data byte 7; RDS PDATM
11.1.8
Data byte 8; RDS PDATL
11.1.9
Data byte 9; RDS COUNT
11.1.10
Data byte 10; RDS PBIN
11.2
Write mode
11.2.1
Subaddress 0H; RDS SET A
11.2.2
Subaddress 1H; RDS SET B
11.2.3
Subaddress 2H; RDSCLK
11.2.4
Subaddress 3H; RDS CONTROL
11.2.5
Subaddress 4H; CONTROL
11.2.6
Subaddress 5H; CSALIGN
11.2.7
Subaddress 6H; MULTIPATH
11.2.8
Subaddress 7H; SNC
11.2.9
Subaddress 8H; HIGHCUT
11.2.10
Subaddress 9H; SOFTMUTE
11.2.11
Subaddress AH; RADIO
11.2.12
Subaddress BH; INPUT and ASI
11.2.13
Subaddress CH; LOUDNESS
11.2.14
Subaddress DH; VOLUME
11.2.15
Subaddress EH; TREBLE
11.2.16
Subaddress FH; BASS
11.2.17
Subaddress 10H; FADER
11.2.18
Subaddress 11H; BALANCE
11.2.19
Subaddress 12H; MIX
11.2.20
Subaddress 13H; BEEP
11.2.21
Subaddress 1FH; AUTOGATE
12
TEST AND APPLICATION INFORMATION
13
PACKAGE OUTLINE
14
SOLDERING
14.1
Introduction to soldering surface mount
packages
14.2
Reflow soldering
14.3
Wave soldering
14.4
Manual soldering
14.5
Suitability of surface mount IC packages for
wave and reflow soldering methods
15
DATA SHEET STATUS
16
DEFINITIONS
17
DISCLAIMERS
18
PURCHASE OF PHILIPS I2C COMPONENTS
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