- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄368631 > TEA1069N (NXP SEMICONDUCTORS) Versatile speech/dialler/ringer with music-on-hold PDF資料下載
參數(shù)資料
| 型號： | TEA1069N |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 無繩電話/電話 |
| 英文描述： | Versatile speech/dialler/ringer with music-on-hold |
| 中文描述： | TELEPHONE MULTIFUNCTION CKT, PDIP42 |
| 封裝： | SHRINK, PLASTIC, DIP-42 |
| 文件頁數(shù)： | 40/44頁 |
| 文件大小： | 301K |
| 代理商： | TEA1069N |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁當(dāng)前第40頁第41頁第42頁第43頁第44頁
1998 Jan 08
40
Philips Semiconductors
Product specification
Versatile speech/dialler/ringer with
music-on-hold
TEA1069; TEA1069A
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook”(order code 9398 652 90011).
SDIP
S
OLDERING BY DIPPING OR BY WAVE
The maximum permissible temperature of the solder is
260
°
C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg max
). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
R
EPAIRING SOLDERED JOINTS
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300
°
C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400
°
C, contact may be up to 5 seconds.
QFP
R
EFLOW SOLDERING
Reflow soldering techniques are suitable for all QFP
packages.
The choice of heating method may be influenced by larger
plastic QFP packages (44 leads, or more). If infrared or
vapour phase heating is used and the large packages are
not absolutely dry (less than 0.1% moisture content by
weight), vaporization of the small amount of moisture in
them can cause cracking of the plastic body. For more
information, refer to the Drypack chapter in our “Quality
Reference Handbook”(order code 9397 750 00192).
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 50 and 300 seconds depending on heating
method. Typical reflow peak temperatures range from
215 to 250
°
C.
W
AVE SOLDERING
Wave soldering is
not
recommended for QFP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.
If wave soldering cannot be avoided, for QFP
packages with a pitch (e) larger than 0.5 mm, the
following conditions must be observed:
A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave)
soldering technique should be used.
The footprint must be at an angle of 45
°
to the board
direction and must incorporate solder thieves
downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured. Maximum permissible solder
temperature is 260
°
C, and maximum duration of package
immersion in solder is 10 seconds, if cooled to less than
150
°
C within 6 seconds. Typical dwell time is 4 seconds
at 250
°
C. A mildly-activated flux will eliminate the need for
removal of corrosive residues in most applications.
R
EPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300
°
C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320
°
C.
CAUTION
Wave soldering is NOT applicable for all QFP
packages with a pitch (e) equal or less than 0.5 mm.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| TEA1081 | Supply circuit with power-down for telephone set peripherals |
| TEA1081T | Supply circuit with power-down for telephone set peripherals |
| TEA1083 | Call progress monitor for line powered telephone sets |
| TEA1083AT | Call progress monitor for line powered telephone sets |
| TEA1083A | Call progress monitor for line powered telephone sets |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TEA1081 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Supply circuit with power-down for telephone set peripherals |
| TEA1081T | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Supply circuit with power-down for telephone set peripherals |
| TEA1083 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Call progress monitor for line powered telephone sets |
| TEA1083A | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Call progress monitor for line powered telephone sets |
| TEA1083AT | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Call progress monitor for line powered telephone sets |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。