參數(shù)資料
型號(hào): TE28F800C3B110
廠商: Intel Corp.
英文描述: 3 VOLT ADVANCED+ BOOT BLOCK 8-, 16-, 32-MBIT FLASH MEMORY FAMILY
中文描述: 3伏高級(jí)啟動(dòng)塊8 - ,16 - ,32 - Mbit閃存家庭
文件頁(yè)數(shù): 1/59頁(yè)
文件大?。?/td> 384K
代理商: TE28F800C3B110
E
PRODUCT PREVIEW
May 1998
Order Number: 290645-001
n
Flexible SmartVoltage Technology
2.7 V
–3.6 V Read/Program/Erase
2.7 V or 1.65 V I/O Option Reduces
Overall System Power
12 V for Fast Production
Programming
n
High Performance
2.7 V–3.6 V: 90 ns Max Access Time
3.0 V–3.6 V: 80 ns Max Access Time
n
Optimized Architecture for Code Plus
Data Storage
Eight 8-Kbyte Blocks,
Top or Bottom Locations
Up to Sixty-Three 64-KB Blocks
Fast Program Suspend Capability
Fast Erase Suspend Capability
n
Flexible Block Locking
Lock/Unlock Any Block
Full Protection on Power-Up
WP# Pin for Hardware Block
Protection
V
PP
=
GND Option
V
CC
Lockout Voltage
n
Low Power Consumption
9 mA Typical Read Power
10 μA Typical Standby Power with
Automatic Power Savings Feature
n
Extended Temperature Operation
–40 °C to +85 °C
n
Easy-12 V
Faster Production Programming
No Additional System Logic
n
128-bit Protection Register
64-bit Unique Device Identifier
64-bit User Programmable OTP
Cells
n
Extended Cycling Capability
Minimum 100,000 Block Erase
Cycles
n
Flash Data Integrator Software
Flash Memory Manager
System Interrupt Manager
Supports Parameter Storage,
Streaming Data (e.g., voice)
n
Automated Word/Byte Program and
Block Erase
Command User Interface
Status Registers
n
SRAM-Compatible Write Interface
n
Cross-Compatible Command Support
Intel Basic Command Set
Common Flash Interface
n
x 16 for High Performance
48-Ball
μ
BGA* Package
48-Lead TSOP Package
n
x 8 I/O for Space Savings
48-Ball
μ
BGA* Package
40-Lead TSOP Package
n
0.25
μ
ETOX VI Flash Technology
The 0.25 μm 3 Volt Advanced+ Boot Block, manufactured on Intel’s latest 0.25 μ technology, represents a
feature-rich solution at overall lower system cost. Smart 3 flash memory devices incorporate low voltage
capability (2.7 V read, program and erase) with high-speed, low-power operation. Flexible block locking
allows any block to be independently locked or unlocked. Add to this the Intel-developed Flash Data
Integrator (FDI) software and you have a cost-effective, flexible, monolithic code plus data storage solution on
the market today. 3 Volt Advanced+ Boot Block products will be available in 48-lead TSOP, 40-lead TSOP,
and 48-ball μBGA* packages. Additional information on this product family can be obtained by accessing
Intel’s WWW page: http://www.intel.com/design/flcomp.
3 VOLT ADVANCED+ BOOT BLOCK
8-, 16-, 32-MBIT
FLASH MEMORY FAMILY
28F008C3, 28F016C3, 28F032C3
28F800C3, 28F160C3, 28F320C3
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